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首页> 外文会议>IMAPS Advanced Technology Workshop on Thermal Management for High Performance Computing and Telecom/Wireless Applications Apr 20-21, 2001, Palo Alto, California >Uncertainty Analysis for Thermal Measurements
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Uncertainty Analysis for Thermal Measurements

机译：热测量的不确定度分析

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摘要

This presentation will discuss the use of statistical analysis techniques for assessing the robustness of a thermal design. Statistical techniques are currently used within Hewlett-Packard for the analysis of thermal data for mid-range HP9000 UNIX server systems. Previously, thermal designs were evaluated by simultaneously setting aE parameters influencing an electronic component's temperature to worst-case values. These parameters include chip power and thermal resistance parameters, ambient temperature, altitude, failed system fans, etc. Given rapidly increasing microprocessor power levels and demanding environmental specifications, this overly conservative approach yields thermal solutions that are unconapetitive in terms of size and cost. An easy-to-use spreadsheet-based analysis tool has been developed to provide a statistical analysis of measured thermal data. In this presentation, the tool is applied to the analysis of measured thermal data for an HP PA-RISC microprocessor heat pipe heat sink. SpecificaEy, the tool generates median microprocessor junction temperature predictions and uncertainty estimates. The tool provides a standard method for assessing thermal data, making comparisons between various thermal solutions and different computer systems simpler. The technique can be appled generally to any thermal measurement.
机译：本演讲将讨论使用统计分析技术评估散热设计的坚固性。惠普当前正在使用统计技术来分析中档HP9000 UNIX服务器系统的热数据。以前，通过同时将影响电子组件温度的aE参数设置为最坏情况的值来评估热设计。这些参数包括芯片功率和热阻参数，环境温度，高度，出现故障的系统风扇等。鉴于微处理器功率水平的快速提高和苛刻的环境规格，这种过于保守的方法所产生的散热解决方案在尺寸和成本方面均无竞争力。已经开发了一种基于电子表格的易于使用的分析工具，可对所测量的热数据进行统计分析。在本演示中，该工具将用于分析HP PA-RISC微处理器热管散热器的热数据。具体来说，该工具生成微处理器结点温度的中值预测值和不确定性估计值。该工具提供了一种评估热数据的标准方法，从而使各种热解决方案和不同计算机系统之间的比较更加简单。该技术通常可适用于任何热测量。

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