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Electro-thermal modeling of power IGBT modules by heat pipe systems

机译：通过热管系统对功率IGBT模块进行电热建模

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This paper presents an electro-thermal model of an IGBT with its cooling system. A thermal model based on a Cauer Resistor-Capacitance (RC) thermal network, is developed in order to predict the IGBT junction temperature in transient operation. The thermal resistances and capacitances are obtained by a mathematical transformation that is applied to a model based on the Foster thermal network. An electrical model of the IGBT is also developed, and it takes into account the dependency of the static electrical parameters of the IGBT with the junction temperature. The electro-thermal model is considered in a boost converter applications, and two cooling modes are studied. The first one uses air convection technique, and the second one consists of a heat pipe cooling system of which the heat sink is cooled by cold plates using water circulation. The model predictions show the effectiveness of the heat pipe cooling system for different operating conditions such as the commutation frequency and the duty ratio. It is demonstrated that the heat pipe cooling system limits the junction temperature to low values which remain below the maximum admissible ones.
机译：本文介绍了IGBT及其冷却系统的电热模型。为了预测瞬态工作中的IGBT结温，开发了基于Cauer电阻-电容（RC）热网络的热模型。通过数学转换获得热阻和电容，该数学转换将应用于基于Foster热网络的模型。还开发了IGBT的电气模型，并考虑了IGBT静态电气参数与结温之间的关系。在升压转换器应用中考虑了电热模型，并研究了两种冷却模式。第一个使用空气对流技术，第二个包括热管冷却系统，该系统的散热器通过水循环利用冷板冷却。模型预测显示了热管冷却系统在不同工况（例如换向频率和占空比）下的有效性。事实证明，热管冷却系统将结温限制在较低值，该值仍低于最大允许值。

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