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首页> 外文会议>International Conference on Mechanical Engineering and Mechanics vol.2; 20051026-28; Nanjing(CN) >Simulation and Experiment Study of Capillary Flow En Underfill Filling Process
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Simulation and Experiment Study of Capillary Flow En Underfill Filling Process

机译：毛细管流动底部填充过程的仿真与实验研究

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摘要

Flip-chips gradually become the mainstream of microelectronic package because of their almost ideal encapsulation density and excellent high-frequency performance. Underfill filling process is very important in flip-chip package. This paper uses three-dimensional flow model to simulate capillary flow underfill filling process. The simulation model reckons in influences of contact angle, the wall of gap between chip and substrate, rims of sold bump joints, and radius of curvature of flow front, and the chip edges' similar wall adhesion effect on surface tension. To verify the results getting from numerical simulations, underfill capillary flow filling experiments were carried through. Through comparative analysis simulation results and experimental results, the results getting from numerical simulations are verified. The phenomena of wave shape in flow front, filling flow velocity being faster both at chip edges and near rim of solder joints, which are shown in simulation results, are compatible with experimental results.
机译：倒装芯片由于其近乎理想的封装密度和出色的高频性能而逐渐成为微电子封装的主流。底部填充工艺在倒装芯片封装中非常重要。本文使用三维流动模型来模拟毛细流动底部填充过程。该仿真模型估计了接触角，芯片与基板之间的间隙壁，所出售的凸点接缝的边缘以及流动前沿曲率半径的影响，以及芯片边缘的相​​似壁粘附力对表面张力的影响。为了验证从数值模拟获得的结果，进行了底部填充毛细管流动填充实验。通过比较分析模拟结果和实验结果，验证了数值模拟得到的结果。仿真结果表明，流锋中的波形现象，芯片边缘处和焊点边缘附近的填充流速都更快，这与实验结果相吻合。

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