首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2001 Pt.1 Oct 28-Nov 2, 2001 Tsukuba, Japan >Comparison of the Growth Characteristics of SiC on Si between Low-Pressure CVD and Triode Plasma CVD
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Comparison of the Growth Characteristics of SiC on Si between Low-Pressure CVD and Triode Plasma CVD

机译:低压CVD与三极管等离子CVD在Si上SiC的生长特性比较

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In order to investigate the effect of the supply of hydrogen radicals during the SiC growth, SiC films were grown on Si substrates by low-pressure thermal CVD (LPCVD) and triode plasma CVD using dimethylsilane (DMS). Activation energy for the epitaxial growth rate of SiC by LPCVD was estimated to be 73 +- 5kcal/mol, whereas that by triode plasma CVD was about 48+-2 kcal/mol. As in the case of the growth rate of SiC using monomethylsilane (MMS), the activation energy by using the triode plasma CVD was reduced about 25kcal/mol in the case of DMS.
机译:为了研究在SiC生长期间氢自由基的供应的影响,通过低压热CVD(LPCVD)和三极管等离子体CVD使用二甲基硅烷(DMS)在Si衬底上生长SiC膜。通过LPCVD,对于SiC的外延生长速率的活化能估计为73±5kcal / mol,而通过三极管等离子体CVD的活化能为约48 + -2kcal / mol。与使用单甲基硅烷(MMS)的SiC的生长速率相同,在DMS的情况下,通过使用三极管等离子体CVD的活化能降低了约25kcal / mol。

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