PREDICTING THE STRENGTH OF SOLDER JOINTS USING COHESIVE ZONE MODELING

机译：使用粘性区域建模预测焊点的强度

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The fracture of a lead-free solder joint (96.5Sn3.0Ag0.5Curnand copper) under mode I loading conditions was simulatedrnusing a cohesive zone model (CZM) implemented inrnANSYS? finite element software. The CZM parametersrnwere determined using mode I fracture data fromrnexperiments with double cantilever beam (DCB) solder jointrnspecimens. These CZM parameters, along with thernmechanical properties of the solder and the copper, werernthen used in the finite element simulations to predict thernfailure loads of solder joints in two configurations: (i) DCBrnjoints and (ii) linear arrays of discrete 1-2 mm solder jointsrnhaving various pitches. The latter specimens permitted anrninvestigation of the parameters affecting load sharing amongrndiscrete joints such as those found in ball grid arrays. Thernmodel predictions were in good agreement with thernexperiments.

机译：使用在rnANSYS中实现的内聚区模型（CZM）模拟了在模式I加载条件下无铅焊点（96.5Sn3.0Ag0.5Curn和铜）的断裂。有限元软件。 CZM参数是使用I型断裂数据通过双悬臂梁（DCB）焊点试样的实验确定的。然后，将这些CZM参数以及焊料和铜的机械性能一起用于有限元模拟中，以两种形式预测焊点的失效载荷：（i）DCB焊点和（ii）1-2 mm离散焊锡的线性阵列关节具有各种节距。后面的标本允许对影响离散接头（例如在球栅阵列中发现的）之间的载荷分配的参数进行调查。模型预测与实验吻合良好。

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来源
《International conference on soldering amp; reliability》|2009年|p.1-7|共7页
会议地点 Toronto(CA)
作者
Siva P. V. Nadimpalli; Jan K. Spelt;
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作者单位

Department of Mechanical and Industrial EngineeringrnUniversity of Toronto, CanadarnToronto, ON, Canada;

Department of Mechanical and Industrial EngineeringrnUniversity of Toronto, CanadarnToronto, ON, Canada;

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会议组织
原文格式 PDF
正文语种 eng
中图分类半导体器件制造工艺及设备;电子元件、组件;
关键词
lead-free solder; fracture; cohesive zone; failurernprediction; array joint;

机译：无铅焊料;断裂;内聚区;失效预测;阵列接头;

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PREDICTING THE STRENGTH OF SOLDER JOINTS USING COHESIVE ZONE MODELING

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