• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International conference on soldering amp; reliability >LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS
【24h】

LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS

机译：服务器级PCBA的无铅组装：认证试验结果

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

At present, insufficient long term thermomechanicalrnreliability performance data exists to support highrncomplexity, lead-free printed circuit board assemblyrn(PCBA) for use within enterprise server and storage classrnapplications. The majority of reported second levelrninterconnect reliability experience with lead-free PCBAsrnhas been generated without adherence to high complexity,rnhigh reliability product life specifications. As a result, manyrnof the lead-free material and assembly process solutionsrndeployed to date have not been characterized according tornmore stringent server and storage reliability requirements.rnThis paper reports the reliability testing results of a lead-freernassembly qualification trial on a mid-range complexity, highrnreliability PCBA sourced with three different printed circuitrnboard (PCB) surface finishes. Reported results includernelectrical functionality through accelerated thermal cyclingrn(ATC), isothermal high temperature storage (HTS), as wellrnas combination shock / vibration / ATC testing. Mechanicalrnfour-point bend test results and implications will berndiscussed. Construction analyses of various interconnectrntechnologies is also included.rnThrough continued product vehicle study, the capability ofrnlead-free processing is being systematically assessed for thernextension of its applicability to higher complexity PCBAs.
机译：目前，长期的热机械可靠性数据不足，无法支持用于企业服务器和存储应用中的高复杂度，无铅印刷电路板组件（PCBA）。在不遵循高复杂度，高可靠性产品寿命规格的前提下，大多数已报告的第二级无铅PCBAs互连可靠性经验已经产生。结果，迄今为止，尚未根据更严格的服务器和存储可靠性要求来表征许多目前采用的无铅材料和组装工艺解决方案。本文报告了中端复杂性的无铅组装资格试验的可靠性测试结果，具有三种不同印刷电路板（PCB）表面光洁度的高可靠性PCBA。报告的结果包括通过加速热循环（ATC），等温高温存储（HTS）以及Wellrnas组合冲击/振动/ ATC测试获得的电气功能。将讨论机械的四点弯曲测试结果及其含义。还包括对各种互连技术的构造分析。通过持续的产品车辆研究，系统地评估了无铅处理的能力，以扩展其对更高复杂性PCBA的适用性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号