• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International Symposium on Eco-Materials Processing amp; Design; 20060108-11; Chengdu(CN) >Effect of Indium on Bonding between Porcelain and Au-Pt-Cu Alloy
【24h】

Effect of Indium on Bonding between Porcelain and Au-Pt-Cu Alloy

机译：铟对瓷与金铂铜合金结合的影响

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Effects of 0.5 wt% Indium addition on the oxidation of Au-Pt-Cu alloy, the interfacial microstructure and bonding strength between porcelain and Au-Pt-Cu-xIn alloys(x = 0, 0.5wt%) were investigated using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, and a tensile tester. The bonding strength of the Au-Pt-Cu and Au-Pt-Cu-0.5In alloys with porcelain was about 24.6 MPa and 49.5 MPa in average, respectively. This higher bonding strength in the Au-Pt-Cu-0.5In alloy compared with the Au-Pt-Cu alloy without In is ascribed to the formation of In_2O_3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy. Especially, the formation of In_2O_3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy leads to enhancing chemical bonding between In_2O_3 and various oxides in porcelain, and also to improving the anchoring effect.
机译：用扫描电子显微镜研究了添加0.5 wt％的铟对Au-Pt-Cu合金氧化，瓷与Au-Pt-Cu-xIn合金（x = 0，0.5wt％）之间的界面微观结构和结合强度的影响，X射线衍射仪，透射电子显微镜和拉伸测试仪。 Au-Pt-Cu和Au-Pt-Cu-0.5In合金与瓷器的结合强度平均分别约为24.6 MPa和49.5 MPa。与不含In的Au-Pt-Cu合金相比，Au-Pt-Cu-0.5In合金的这种更高的结合强度归因于在瓷和Au-Pt-Cu-0.5In合金之间的界面处形成了In_2O_3。特别地，在瓷和Au-Pt-Cu-0.5In合金之间的界面处形成In_2O_3导致增强In_2O_3与瓷中的各种氧化物之间的化学键合，并且还改善了锚固效果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号