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首页> 外文会议>International Workshop on Advanced Metallic Materials and Processing Techniques for Aeronautical Applications; 20051118-20; Nanjing(CN) >Microstructure and thermal and electric conductivities of high dense Mo/Cu composites
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Microstructure and thermal and electric conductivities of high dense Mo/Cu composites

机译：高密度Mo / Cu复合材料的微观结构以及热导率

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摘要

For electronic packaging applications, Mo/Cu composites with volume fractions of 55%, 60% and 67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and thermal and electric conduction properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniform, and the Mo-Cu interfaces are clean and free from interfacial reaction products and amorphous layers; the densifications of the Mo/Cu composites are higher than 99%. The thermal conductivities of Mo/Cu composites range from 220 to 270 W/(m · ℃ ) and decrease with an increase in volume fraction of Mo content. The thermal conductivities agree well with the predicted values of theoretical models. The electric conductivities of Mo/Cu composites are in the range of 22 - 28 MS/m and decrease with the increase of Mo content. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity Mo/Cu composites, which are attained through the cost-effective squeeze-casting technology processes.
机译：对于电子包装应用，通过专利压铸技术制造了Mo / Cu复合材料，其Mo含量分别为55％，60％和67％。研究了Mo / Cu复合材料的微观结构以及导热和导电性能。结果表明，Mo颗粒均匀且均匀，Mo-Cu界面清洁，无界面反应产物和无定形层。 Mo / Cu复合材料的致密化高于99％。 Mo / Cu复合材料的热导率范围为220至270 W /（m·℃），并且随着Mo含量的体积分数的增加而降低。热导率与理论模型的预测值非常吻合。 Mo / Cu复合材料的电导率在22-28 MS / m的范围内，并且随着Mo含量的增加而降低。更高的导热性和导电性归因于全密度和高纯度的Mo / Cu复合材料，这是通过经济高效的压铸技术工艺实现的。

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