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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Microstructure and thermal conductivity of Cu/diamond composites with Ti-coated diamond particles produced by gas pressure infiltration
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Microstructure and thermal conductivity of Cu/diamond composites with Ti-coated diamond particles produced by gas pressure infiltration

机译：气压渗透法制备含钛涂层金刚石颗粒的铜/金刚石复合材料的微观结构和导热系数

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摘要

As an attractive thermal management material, diamond particles reinforced Cu matrix (Cu/diamond) composites generally exhibit thermal conductivities lower than expected. To exploit the potential of heat conduction, a combination of Ti coating on diamond particles and gas pressure infiltration was used to prepare Cu/diamond(Ti) composites. A high thermal conductivity of 716 W/mK and a low coefficient of thermal expansion of 5.8 ppm/K at 323 K were obtained in the composites. Auger electron spectroscopy (AES) characterization shows that a TiC layer was formed between Cu matrix and diamond reinforcement, which is responsible for the enhancement of thermal conductivity. The results suggest that Ti coating can significantly promote interface bonding between Cu and diamond and gas pressure infiltration is an effective method to produce Cu/diamond composites. (C) 2015 Elsevier B.V. All rights reserved.
机译：作为一种有吸引力的热管理材料，金刚石颗粒增强的铜基复合材料（铜/金刚石）的导热系数通常低于预期。为了利用热传导的潜力，结合使用金刚石颗粒上的Ti涂层和气压渗透技术来制备Cu /金刚石（Ti）复合材料。在复合材料中获得了716 W / mK的高导热率和在323 K下的低热膨胀系数5.8 ppm / K。俄歇电子能谱（AES）表征表明，在Cu基体和金刚石增强层之间形成了TiC层，这有助于提高导热性。结果表明，Ti涂层可以显着促进Cu与金刚石之间的界面键合，而气压渗透是制备Cu /金刚石复合材料的有效方法。 （C）2015 Elsevier B.V.保留所有权利。

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