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首页> 外文会议>IPC Electronic Circuits World Convention, Printed Circuits Expo, Apex, and the Designers Summit 2005(ECWC 10): The Perfect Fit vol.2 >Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies
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Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies

机译：无铅倒装芯片和芯片级封装检查：新挑战将需要新的检查技术

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This paper has highlighted a very specific defect of component side ball delamination of area array packages, in particular FCs and CSPs, by examining and summarizing current research available on this critical subject. It has become clear that the lead free soldering process will create new process challenges for these components. Simply put, the existing problems of component side delamination will be exacerbated in a lead free process. With this knowledge, therefore, it is essential to implement proper inspection and test procedures in order to guarantee a quality lead free FC and CSP soldering process. Failure to discover such fatal process defects, as highlighted above, will result in in-field failures, and will generate unnecessary warranty and repair costs. PCB manufacturers implementing lead free and using low profile area array packages such as FCs and CSPs should consider using new optical inspection technologies designed to detect these very specific defects in a non- destructive manner as a supplement to their current equipment. The implementation of thorough First Article Inspection procedures with newly designed inspection equipment is a cost effective alternative to the high costs of destructive methods, or the even higher costs of non-discovery of fatal defects. Properly informed and properly equipped, these challenges for FC and CSP production should be seen as a new opportunity to increase process quality, and increase product reliability in the lead free future.
机译：本文通过检查和总结有关此关键主题的最新研究成果，突出了区域阵列封装，尤其是FC和CSP的组件侧球分层的一个非常具体的缺陷。显然，无铅焊接工艺将对这些组件提出新的工艺挑战。简而言之，在无铅工艺中，组件侧分层的现有问题将更加严重。因此，以这种知识为基础，必须执行适当的检查和测试程序，以确保高质量的无铅FC和CSP焊接工艺。如上突出显示的那样，未能发现此类致命的过程缺陷将导致现场故障，并产生不必要的保修和维修费用。实施无铅并使用诸如FC和CSP之类的薄型面阵封装的PCB制造商应考虑使用旨在以非破坏性方式检测这些非常特殊的缺陷的新型光学检测技术作为其当前设备的补充。用新设计的检验设备实施彻底的《第一条检验》程序，是一种具有成本效益的选择，可以替代破坏性方法的高成本，或者甚至更高的未发现致命缺陷的成本。对于FC和CSP生产，这些正确的信息和适当的装备，这些挑战应被视为提高工艺质量和提高无铅未来产品可靠性的新机会。

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