Fast Root Cause Analysis Based on Electrical Defect Localization

机译：基于电缺陷定位的快速根本原因分析

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The ability to rapidly perform root cause analysis (RCA) onrnyield limiting defects is critical to a fab's ramp. Here wernpresent two methodologies for RCA using specially designedrnhigh density test structure arrays and a FIB/SEM DualBeam.rnThese methodologies have been proven to identify the rootrncause of both hard and soft electrical failures. Correlationrnbetween electrical test results and the yield-impacting defectsrnare presented.

机译：快速执行根本原因分析（RCA）合格率限制缺陷的能力对于晶圆厂的产能至关重要。在这里，我们介绍了两种使用专门设计的高密度测试结构阵列和FIB / SEM DualBeam进行RCA的方法。这些方法已被证明可以识别硬性和软性电气故障的根本原因。提出了电气测试结果与影响良率的缺陷之间的关系。

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《ISTFA 2008 : Conference proceedings from the 34th international symposium for testing and failure analysis》|2008年|85-87|共3页
会议地点 Portland OR(US);Portland OR(US)
作者
Michael Schmidt; rnLarry Dworkin; rnChristopher Hess; rnMichele Squcciarini; rnShia Yu; rnJonathan Burrows;
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作者单位

FEI Company, Hillsboro, Oregon 97124, USArnMichael.Schmidt@fei.com;

FEI Company, Hillsboro, Oregon 97124, USA;

PDF Solutions Inc., San Jose, CA 95110, USA;

PDF Solutions Inc., San Jose, CA 95110, USA;

PDF Solutions Inc., San Jose, CA 95110, USA;

PDF Solutions Inc., San Jose, CA 95110, USA;

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Fast Root Cause Analysis Based on Electrical Defect Localization

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