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Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages

机译:包装激光烧蚀过程中引起的电气故障的检测和表征

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摘要

Decapsulation of complex semiconductor packages for failurernanalysis is enhanced by laser ablation. If lasers are potentiallyrndangerous for Integrated Circuits (IC) surface they alsorngenerate a thermal elevation of the package during the ablationrnprocess. During measurement of this temperature it wasrnobserved another and unexpected electrical phenomenon in thernIC induced by laser. It is demonstrated that this newrnphenomenon is not thermally induced and occurs under certainrnablation conditions.
机译:激光烧蚀增强了用于故障分析的复杂半导体封装的解封。如果激光对集成电路(IC)表面有潜在危险,则它们还会在烧蚀过程中产生封装的热升高。在测量该温度的过程中,它观察到了激光诱导的IC中的另一个意外电现象。证明了这种新现象不是热诱导的,而是在某些消融条件下发生的。

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