Highly effective and high throughput chipping monitor to prevent wafer cracking

机译：高效，高产量的碎屑监控器，可防止晶圆破裂

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摘要

During semiconductor manufacturing processes, wafer cracking inside a tool is a very serious problem in a fab. It results in costs from tool recovery, wafer and time loss, and potential contamination for other wafers. Most wafer cracking cases result from wafer edge chipping. A good chipping monitor solution will save more than 100 times the costs related to wafer cracking cases.

机译：在半导体制造过程中，工具内部的晶圆开裂是晶圆厂中非常严重的问题。这将导致工具回收，晶圆浪费和时间损失以及其他晶圆的潜在污染等方面的成本。大多数晶片破裂情况是由晶片边缘碎裂引起的。一个好的切屑监控器解决方案将节省与晶圆开裂情况相关的成本的100倍以上。

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来源
《Joint 2015 e-Manufacturing amp; Design Collaboration Symposium 2015 and 2015 International Symposium on Semiconductor Manufacturing》|2015年|1-2|共2页
会议地点 Taipei(CT)
作者
Yen C.H.; Fu Y.L.; Lee T.S.; Lo H.T.; Chang J.Y.; Peng Tim; Chen Henry; Huang Ray;
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作者单位

Taiwan Semicond. Manuf. Co.(tsmc), Hsinchu, Taiwan;

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会议组织
原文格式 PDF
正文语种 eng
中图分类
关键词
machine tools; process monitoring; semiconductor device manufacture; semiconductor technology; high throughput chipping monitor; semiconductor manufacturing processes; time loss; tool recovery; wafer cracking; wafer cracking prevention; wafer edge chipping; Contamination; Image edge detection; Inspection; Manufacturing; Monitoring; Throughput; Yield estimation; Chipping; Edge inspection; VisEdge; Wafer crack;

机译：机床;过程监控;半导体器件制造;半导体技术;高通量芯片监控器;半导体制造工艺;时间损失;工具回收;晶片破裂;防止晶片破裂;晶片边缘崩裂;污染;图像边缘检测;检查;制造;监控产量;产量估计;切削;边缘检查; VisEdge;晶圆裂纹;;

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2. Monitoring microstructural evolution, crack formation, and damage characteristics near crack tip in a highly filled elastomer-using digital radiography X-ray techniques [J] . Liu CT Experimental Mechanics . 2007,第1期

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4. Highly effective and high throughput chipping monitor to prevent wafer cracking [C] . Yen C.H., Fu Y.L., Lee T.S., Joint 2015 e-Manufacturing Design Collaboration Symposium 2015 . 2015

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5. Cost-Effective Integrated Wireless Monitoring of Wafer Cleanliness Using SOI Technology. [D] . Pandit, Vedhas. 2010

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Highly effective and high throughput chipping monitor to prevent wafer cracking

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