首页> 外文会议>Per Kofstad Memorial Symposium on High Temperature Corrosion and Materials Chemistry Nov 1999, Honolulu, Hawaii >OXIDATION OF HIGH PURITY NICKEL BETWEEN 600 AND 1200 C: OXIDE SCALE MORPHOLOGY AND GROWTH KINETICS
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OXIDATION OF HIGH PURITY NICKEL BETWEEN 600 AND 1200 C: OXIDE SCALE MORPHOLOGY AND GROWTH KINETICS

机译:600和1200 C之间高纯镍的氧化:氧化物的形貌和生长动力学

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The oxidation of high purity nickel was studied between 600 and 1200℃ for scale thickness up to 10μm. At or above 1100℃, the scale growth kinetics are parabolic. The scales are then compact with columnar and facetted NiO grains. A complex behavior is observed below 1000℃: ⅰ) for test temperatures between 800-1000 ℃, mass gain curves cannot be fitted to a parabola, ⅱ) differing scale morphologies and microstructures are observed depending on scale thickness and temperature, ⅲ) a duplex scale is formed below 800℃. At temperatures below 800℃, the growth of NiO platelets on the top of a primarily cellular and porous scale is observed. In addition to the possible effect of grain-boundary diffusion, the departure of growth kinetics from simple parabolic kinetics could be also related to the complex scale microstructure and its evolution during scale growth.
机译:研究了在600至1200℃之间氧化规模高达10μm的高纯镍的氧化。在1100℃以上,水垢的生长动力学是抛物线的。然后将鳞片用圆柱状和刻面的NiO颗粒压实。在1000℃以下观察到复杂的行为:ⅰ)对于800-1000℃之间的测试温度,质量增益曲线无法拟合到抛物线,ⅱ)取决于鳞片厚度和温度,观察到不同的鳞片形态和微观结构,ⅲ)双联体800℃以下形成水垢。在低于800℃的温度下,观察到NiO血小板在主要细胞和多孔鳞片的顶部生长。除了晶界扩散的可能影响外,生长动力学与简单抛物线动力学的偏离还可能与复杂的尺度微观结构及其在尺度生长过程中的演化有关。

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