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首页> 外文会议>Laser applications in microelectronic and optoelectronic manufacturing (LAMOM) XIX >Nanosecond laser-induced back side wet etching of fused silica with a copper-based absorber liquid
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Nanosecond laser-induced back side wet etching of fused silica with a copper-based absorber liquid

机译：纳秒激光诱导的铜基吸收液对熔融石英的背面湿法蚀刻

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摘要

Cost-efficient machining of dielectric surfaces with high-precision and low-roughness for industrial applications is still challenging if using laser-patterning processes. Laser induced back side wet etching (LIBWE) using UV laser pulses with liquid heavy metals or aromatic hydrocarbons as absorber allows the fabrication of well-defined, nm precise, free-form surfaces with low surface roughness, e.g., needed for optical applications. The copper-sulphate-based absorber CuSO_4/K-Na-Tartrate/NaOH/formaldehyde in water is used for laser-induced deposition of copper. If this absorber can also be used as precursor for laser-induced ablation, promising industrial applications combining surface structuring and deposition within the same setup could be possible. The etching results applying a KrF excimer (248 nm, 25 ns) and a Nd:YAG (1064 nm, 20 ns) laser are compared. The topography of the etched surfaces were analyzed by scanning electron microscopy (SEM), white light interferometry (WLI) as well as laser scanning microscopy (LSM). The chemical composition of the irradiated surface was studied by energy-dispersive X-ray spectroscopy (EDX) and Fourier transform infrared spectroscopy (FT-IR). For the discussion of the etching mechanism the laser-induced heating was simulated with finite element method (FEM). The results indicate that the UV and IR radiation allows micro structuring of fused silica with the copper-based absorber where the etching process can be explained by the laser-induced formation of a copper-based absorber layer.
机译：如果使用激光图案化工艺，则对于工业应用而言，具有成本效益的加工具有高精度和低粗糙度的电介质表面仍然具有挑战性。使用紫外激光脉冲，液态重金属或芳烃作为吸收剂的激光诱导背面湿法蚀刻（LIBWE），可制造出定义明确的，纳米精度的，具有低表面粗糙度的自由形式表面，例如光学应用所需。水中的硫酸铜基吸收剂CuSO_4 / K-Na-酒石酸钾/ NaOH /甲醛用于激光诱导的铜沉积。如果该吸收剂也可用作激光诱导烧蚀的前驱物，那么在同一装置内将表面结构化和沉积结合起来的有前途的工业应用将是可能的。比较了使用KrF准分子（248 nm，25 ns）和Nd：YAG（1064 nm，20 ns）激光的蚀刻结果。通过扫描电子显微镜（SEM），白光干涉仪（WLI）以及激光扫描显微镜（LSM）来分析蚀刻表面的形貌。通过能量色散X射线光谱（EDX）和傅里叶变换红外光谱（FT-IR）研究了被辐照表面的化学成分。为了讨论蚀刻机理，使用有限元方法（FEM）模拟了激光诱导的加热。结果表明，UV和IR辐射允许使用铜基吸收剂对熔融石英进行微结构化，其中蚀刻过程可以通过激光诱导的铜基吸收剂层形成来解释。

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