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首页> 外文会议>Laser-based micro- and nanopackaging and assembly VI >Rotating Optics for Laser Taper-Drilling in Research and Production
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Rotating Optics for Laser Taper-Drilling in Research and Production

机译：研发生产中用于激光锥度钻孔的旋转光学器件

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摘要

Drilling of micro through-holes in defined geometry, i.e. entrance diameter and taper, is gaining in importance in different fields of application and production. To exploit the advantages of laser technology for micro machining, versatile trepanning systems based on rotating optics have been designed and implemented. The advanced trepanning systems enable the controlled adjustment of beam displacement and inclination during operation. With a patented measuring device, the angular position of the rotating optics is determined online. The presented compact and low-weight trepanning systems can drill differently tapered through-holes with a diameter in a range of 50 to 1500 μm. Various solid-state laser sources have been used in combination with the presented laser trepanning system for material ablation. The wavelength und pulse width range from 355 to 1550 nm and sub-ps to 100 ns. The novel trepanning systems have been customized for different applications, ranging from basic research quest to industrial production. This presentation outlines the development steps and application results, accenting laser micro drilling of up to 1 mm thick metal and dielectric samples.
机译：在不同的应用和生产领域中，在限定的几何形状即入口直径和锥度上钻微通孔变得越来越重要。为了利用激光技术进行微加工的优势，已经设计并实现了基于旋转光学器件的多功能切入系统。先进的开孔系统可在操作过程中对光束位移和倾斜度进行受控调节。使用获得专利的测量设备，可以在线确定旋转光学器件的角位置。提出的紧凑和轻巧的挖孔系统可以钻出直径在50至1500μm范围内的不同锥度的通孔。各种固态激光源已与本发明的激光刻蚀系统结合使用以进行材料烧蚀。波长和脉冲宽度范围为355至1550 nm，亚ps至100 ns。新颖的挖矿系统已针对不同的应用进行了定制，从基础研究到工业生产。本演讲概述了开发步骤和应用结果，重点是对高达1毫米厚的金属和介电样品进行激光微钻孔。

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