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Ion track lithography: novel low-cost process to form deep vertical and high aspect ratio MEMS in flexible laminates

机译:离子轨迹光刻:在柔性层压板中形成深垂直和高纵横比MEMS的新型低成本工艺

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摘要

High aspect ratio microstructures are today of utterly importance in MEMS. The process described in this paper can be used to produce deep, vertical microstructures in polyimide based materials, used in e.g. flexible printed circuit boards (FPCBs). Stacked polyimide and metal layers have the potential of integrating microelectronic circuits with above applications. The process is capable of producing regions with perpendicular sub-micron metal wire connections at numerous, arbitrarily specified locations. The flexible laminate is irradiated with heavy ions creating a vertical damage anisotropy (ion tracks) in the polymer layer. Lithographically defined apertures in the metallic layer define the geometry. The tracks exposed are selectively developed forming nanometer-wide pores. Metallic structures have been replicated in these pores by electrodeposition of metals. Demonstrator microstructures and highly vertical, through hole microvias have been fabricated. Ion track technology is promising for ultra-high density via batch production and has a potential of further miniaturizing via dimensions.
机译:今天,高纵横比的微结构在MEMS中非常重要。本文所述的工艺可用于在聚酰亚胺基材料中产生深的垂直微结构,例如用于柔性印刷电路板(FPCB)。堆叠的聚酰亚胺和金属层具有将微电子电路集成到上述应用中的潜力。该方法能够在许多任意指定的位置产生具有垂直亚微米金属线连接的区域。用重离子辐照挠性层压板,在聚合物层中产生垂直损伤各向异性(离子轨迹)。金属层中的光刻定义的孔定义了几何形状。暴露的轨道被选择性地显影以形成纳米级的孔。通过金属电沉积在这些孔中复制了金属结构。已经制造了演示器的微结构和高度垂直的通孔微孔。离子跟踪技术有望通过批量生产实现超高密度,并有望进一步缩小通孔尺寸。

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