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Integrated Imaging Sensors

机译：集成成像传感器

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摘要

The objectives of the Integrated Imaging Sensors (I~2S) Program are twofold. The first is to develop and deliver a rifle sight containing a single aperture and optical path for receiving, combining, and viewing radiation from the separate infrared (IR) and visible bands in a single image simultaneously. The second is to develop a sensor array sensitive in the radiation band spanning approximately from 0.4 μm to 1.7 μm by "fusing" indium-gallium-arsenic material onto silicon charge coupled devices. The ability to coincidentally and simultaneously form images from these two separate radiation bands is expected to significantly improve the detection and identification of objects from the case where only one radiation band is employed. Additionally, extending the cutoff of the visible band from 0.9 μm to 1.7 μm is expected to enhance viewing in this band as there is more available light, and further lessens the exacting requirement of designing nearly noise free detectors.
机译：集成成像传感器（I〜2S）计划的目标是双重的。首先是开发和交付一个步枪瞄准器，其中包含一个光圈和一个光路，用于同时接收，组合和查看来自单个红外（IR）和可见波段的辐射，同时在单个图像中观察。第二个是通过将铟镓砷材料“融合”到硅电荷耦合器件上，开发一种在约0.4μm至1.7μm的辐射带中敏感的传感器阵列。从仅使用一个辐射带的情况下，期望从这两个单独的辐射带同时并同时形成图像的能力将显着改善对象的检测和识别。另外，随着可见光的增加，将可见光波段的截止范围从0.9μm扩展到1.7μm有望增强该波段的可见性，并进一步减少设计几乎无噪声的探测器的严格要求。

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