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首页> 外文会议>Pan Pacific Microelectronics Symposium >METHODS OF MICRO BALL BUMPING FOR WAFER LEVEL AND 3-DIMENSIONAL APPLICATIONS USING SOLDER SPHERE TRANSFER AND SOLDER JETTING
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METHODS OF MICRO BALL BUMPING FOR WAFER LEVEL AND 3-DIMENSIONAL APPLICATIONS USING SOLDER SPHERE TRANSFER AND SOLDER JETTING

机译：使用焊球转移和焊接喷射的晶片水平和三维应用的微球撞击方法

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The miniaturization in electronics is driven by size reduction and cost, however by increasing the technical performance of the device. In regard to wafer level applications flip chip technology is still one of the interconnection methods with the potential of highest integration and cost savings. For applications other than on wafer level, 3-dimensional packages like e.g. camera modules, read-write heads for hard disk drives and various other applications a solder jetting method using solder ball diameters down to 30μm is used. To explore this potential, cost-efficient solder bumping technologies for the processing of flip chips on wafer level as well as for 3-dimensional devices have been developed and qualified. The research has shown that the underfill process is one of the most crucial factors when it comes to Flip Chip miniaturization for high reliability applications. Therefore, high performance underfill material was qualified initially [1]. Wafer level solder application has been done using wafer level solder sphere transfer process against what solder sphere jetting technology was used for other applications than wafer level. Wafer level solder sphere transfer technology uses a patterned vacuum tooling fixture to simultaneously pick up preformed spheres and transfer them all over the wafer at once. The latter is a technique that drops a preformed solder sphere onto the bond pad while simultaneously reflowing the ball in-place using a laser. This tool has been used for many years in the industry, it is commonly known in the industry as a solder ball bumping tool. For the described work the process was scaled down for processing solder spheres with a diameter down to 30 μm. Besides presenting the above described methods in detail various applications as well as reliability data of assembled flip chips with micro solder bumps according to MIL-STD883G will be shown.
机译：电子设备的小型化由尺寸减小和成本驱动，但通过提高设备的技术性能。关于晶圆级应用，倒装芯片技术仍然是一个互连方法之一，具有最高集成和成本节约。对于除晶片级别以外的应用，如图1所示的三维包装。相机模块，用于硬盘驱动器的读写头和各种其他应用，使用使用焊球直径降至30μm的焊接喷射方法。为了探索这种潜在的，经济高效的焊料凸块技术，用于处理晶片水平的翻转芯片以及三维器件的处理。该研究表明，底部填充过程是倒装芯片小型化以进行高可靠性应用时最重要的因素之一。因此，最初符合高性能底部填充材料[1]。已经使用晶圆级焊料球体转移过程完成了晶片级焊料应用，该方法针对除晶片水平的其他应用使用的焊料球体喷射技术。晶片级焊球转移技术采用图案化的真空工具固定装置同时拾取预制的球体并立即将它们全部传递。后者是将预成型焊料球放在键合垫上的技术，同时使用激光反射球。该工具已在业内使用多年，这在工业中众所周知作为焊球碰撞工具。对于所描述的工作，将该过程缩小，用于加工直径下达30μm的焊料球。除了在详细介绍上述方法之外，还将示出了根据MIL-STD883G的微焊料凸块的组装翻转芯片的各种应用以及具有根据MIL-STD883G的微焊料凸块的可靠性数据。

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