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ADVANCES IN INFRARED IMAGING METHODS FOR SILICON MATERIAL CHARACTERIZATION

机译:硅材料表征的红外成像方法研究进展

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Infrared imaging methods have been demonstrated as being valuable means to extract informationabout material quality. The main parameters under investigation are the minority carrier lifetime, the free carrierdensity (base doping, emitter diffusion), and the trap density. Infrared imaging methods are mainly based on thedetection of infrared radiation emitted by the sample. Depending on the origin of the radiation, recombinationluminescence in the near infrared or free carrier emission in the mid wavelength infrared is recorded. We present thestate of the art of infrared imaging techniques for silicon material. These include Carrier Density Imaging / InfraredLifetime Mapping, Photoluminescence Imaging for fast lifetime measurements, and trap density measurements foradvanced defect characterization. Emphasis is put on the correction of spurious surface effects, on calibrationtechniques for Photoluminescence Imaging, on progress in trap characterization, and on diffusion lengthmeasurements on solar cells.
机译:红外成像方法已被证明是提取信息的宝贵手段 关于材料质量。研究中的主要参数是少数载流子寿命,自由载流子 密度(基极掺杂,发射极扩散)和陷阱密度。红外成像方法主要基于 检测样品发出的红外辐射。根据辐射的来源,重新组合 记录近红外光的发光或中波长红外光的自由载流子发射。我们提出 硅材料的红外成像技术的最新技术水平。这些包括载波密度成像/红外 终生映射,光致发光成像可实现快速的寿命测量,而阱密度的测量可用于 先进的缺陷表征。重点放在校正杂散表面效应,校准 发光成像技术,陷阱表征的进展以及扩散长度 测量太阳能电池。

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