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首页> 外文会议>IPC apex expo technical conference >Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
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Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly

机译：解决电子组装头枕缺陷的挑战

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摘要

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in-pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
机译：该头在枕头缺陷已经成为自无铅技术的实施在行业中一种比较常见的故障模式，产生备受关注。一种头部在枕头缺陷是球栅阵列（BGA）的整个焊点的不完全润湿，晶片级封装（CSP），或甚至一个封装上封装（PoP）并且其特征在于作为异常处理，其中焊膏和BGA球都回流，但不聚结。当在横截面看，它实际上看起来像一个头已经压成柔软的枕头。有头在枕头缺陷两个主要来源：润湿性差和PWB或封装翘曲。浸润不良可导致从各种来源，如焊球氧化，不适当的热回流温度曲线或助熔作用较差。本文针对头在枕头缺陷的三个来源或有助​​于问题（供给，工艺及材料）。这将彻底检讨这三个问题以及它们如何与导致头在枕头缺陷。另外，头在枕头废除计划将与现实生活中的例子来呈现将是说明这些头在枕头的解决方案。

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