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首页> 外文会议>61st Electronic Components Technology Conference, 2011 >Enhancement of dielectric strength and processibility of high dielectric constant Al nanocomposite by organic molecule treatment
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Enhancement of dielectric strength and processibility of high dielectric constant Al nanocomposite by organic molecule treatment

机译：通过有机分子处理提高高介电常数Al纳米复合材料的介电强度和可加工性

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Processible high-dielectric (high K) and low loss materials are in great and urgent demand for power module packaging of next generation low power integrated heterogeneous systems, where efforts to migrate current bulky AC-DC converting systems to 2D/3D high density integrated systems will be intensively made. We had demonstrated very high K composites (over 150) with low loss, where a core-shell structure (Al2O3 passivation shell and Al core) of aluminum particles plays a critical role for the permittivity. The composite showed high adhesion onto the organic substrates and copper surfaces. However, one challenging issue on the core-shell Al composite is the low dielectric strength (breakdown voltage), which limits its use in high power applications. The low breakdown voltage is attributed to the dielectrically weak surface of the Al particles. The thin Al2O3 shell with a thickness in the order of tens of nanometers limits its dielectric strength. This study focuses on surface modification of the core-shell Al nanoparticles with organic molecules that can provide not only the high dielectric strength but also improved dispersion and processibility in epoxy resins. We found that the epoxy nanocomposite filled with organic molecules-treated core-shell Al particles shows a dramatic improvement in dielectric breakdown and dispersion. Effects of the different coating molecules on the breakdown voltage and dielectric properties were studied. The mechanism of the interface chemical treatment was discussed. In addition to the enhanced dielectric strength, the improved flowability and processibility of the high filler loaded compound by the surface modification and using a bimodal particle size are presented.
机译：对于下一代低功率集成异构系统的功率模块封装，迫切需要可加工的高介电（高K）和低损耗材料，在该系统中，人们努力将当前庞大的AC-DC转换系统迁移到2D / 3D高密度集成系统将进行密集的制作。我们已经证明了高损耗低损耗的高K复合材料（超过150种），其中铝颗粒的核-壳结构（Al 2 O 3 钝化壳和Al核）起作用介电常数的关键作用。该复合材料在有机基材和铜表面上显示出高附着力。然而，核-壳铝复合材料的一个具有挑战性的问题是介电强度低（击穿电压），这限制了其在高功率应用中的使用。低击穿电压归因于Al颗粒的介电弱表面。 Al 2 O 3 薄壳（厚度约为几十纳米）限制了其介电强度。这项研究的重点是用有机分子对核-壳型铝纳米颗粒进行表面改性，这种改性不仅可以提供高介电强度，还可以改善在环氧树脂中的分散性和可加工性。我们发现，填充有有机分子处理的核-壳型Al颗粒的环氧纳米复合材料在介电击穿和分散方面显示出显着改善。研究了不同涂层分子对击穿电压和介电性能的影响。讨论了界面化学处理的机理。除了增强的介电强度外，还提出了通过表面改性和使用双峰粒度提高了填充高填料的化合物的流动性和可加工性。

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