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首页> 外文会议>IEEE Electronics Packaging Technology Conference >Effect of the laser parameters, epoxy mold compound properties and mold tool surface finishing on mark legibility of encapsulated IC package
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Effect of the laser parameters, epoxy mold compound properties and mold tool surface finishing on mark legibility of encapsulated IC package

机译：激光参数，环氧树脂复合性能和模具刀具表面精加工在封装IC封装的标记易读性上

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Changing of quality requirement in manufacturing technologies has to be followed by an adaption of material and process parameters. With the rapid emerging vision inspection technologies, 100% automated optical inspection as quality firewall is always a preferred option to pursue. In the case of transition from human to automated optical inspection to enhance defect detectability, the adaption effort is high due to different capabilities between human and machines on observation and interpretation of the criteria. This will strongly affect the justification of acceptance level which will subsequently cause over or under rejection. For encapsulated IC, the challenges are not only on the ability to detect the defect but also to recognize the laser marking character printed on the surface of the mold compound, which are used as traceability and identification purpose. A theoretical concept is being described to get a grasp of the occurring mechanism. From laser mark aspect, respective factors such as marking depth range coupled with correct marking size with respect to the field of view (FOV) are identified as major contributor for mark legibility. From material point of view, the compatibility of wax type (ratio of hydrophilic and hydrophobic parts) towards multi aromatic resin (MAR) or multifunctional resin (MFR) is identified as the cause of the flow mark or wax stain which eventually contribute the noise of visual inspection. Also from material aspect, types of flame retardant either metal hydroxide or organic phosphorous cause low curability which affects the molded package surface evenness eventually affect visual inspection results. From mold tool aspect, the range of lower roughness average (Ra) of the Electrical Discharge Surface (EDM) mold cavity surface is preferred for better mark legibility. At the end, a proposal is given on parameters, material and tool set to get the best encapsulated IC package surfaces with clear and legible marking. The constraints and corresponding potential risks are also discussed in this paper in order to achieve the best results yet not induce other negative impact.
机译：改变制造技术的质量要求必须进行材料和工艺参数的适应。随着快速新兴的视觉检验技术，100 ％自动化光学检查作为质量防火墙始终是追求的首选选择。在从人从人到自动化光学检查来提高缺陷的可检测性的情况下，由于人和机器之间的观察和解释的观察和解释的不同能力，适应性努力很高。这将强烈影响接受水平的理由，随后将导致拒绝或拒绝。对于封装的IC，挑战不仅可以检测缺陷的能力，还不仅识别在模具化合物表面上印刷的激光标记字符，它们被用作可追溯性和识别目的。正在描述理论概念来掌握发生的机制。从激光标记方面，诸如标记深度范围的相应因素与相对于视野（FOV）耦合的标记深度范围（FOV）被识别为标记易读的主要贡献者。从材料的角度来看，蜡型（亲水和疏水性零件的比率）朝向多芳族树脂（MAR）或多功能树脂（MFR）的相容性被鉴定为流标或蜡染色的原因，最终导致噪音视力检查。此外，来自材料方面，阻燃剂的类型的金属氢氧化物或有机磷原因导致低可固化性，影响模塑包装表面的均匀度最终影响视觉检查结果。从模具工具方面，优选放电表面（EDM）模腔表面的较低粗糙度（RA）的范围，以便更好地标记易读性。最后，提出了一个关于参数，材料和工具集的提议，以获得具有清晰清晰明显的标记的最佳封装的IC封装曲面。本文还讨论了约束和相应的潜在风险，以达到最佳效果，尚未诱导其他负面影响。

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