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首页> 外文会议>International Conference on Electronic Packaging Technology >Silver Nanoparticle deposited Boron Nitride Nanosheet/Nanofibrillated Cellulose Composites with Enhanced Thermal Conductivity
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Silver Nanoparticle deposited Boron Nitride Nanosheet/Nanofibrillated Cellulose Composites with Enhanced Thermal Conductivity

机译：银纳米粒子沉积氮化硼纳米片/纳米纤化纤维素复合材料，具有增强的导热率

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摘要

As modern electronics move towards miniaturization, high-degree integration and multi-functionalization, a large amount of heat will be generated during the operation of electronic devices. Redundant heat will cause the failure of electronic devices. One important solution is to fabricate thermally conductive composites to replace conventional packaging materials. Herein, we report on fabrication of silver nanoparticle deposited boron nitride nanosheet/nanofibrillated cellulose composite with a high cross-plane thermal conductivity up to 1.31 Wm~(-1)K~(-1). The silver nanoparticle can reduce the interface thermal resistance between adjacent boron nitride nanosheets by playing a bridge-connected role, resulting in more thermal conductive pathways inside the boron nitride nanosheet/nanofibrillated cellulose composite. In addition, the incorporation of silver does not destroy the electric insulation of the pristine boron nitride nanosheet/nanofibrillated cellulose composite. This strategy opens a new insight for the fabrication of polymer-based materials with enhanced thermal conductivity.
机译：随着现代电子产品走向小型化，高度集成和多功能化，将在电子设备的运行期间产生大量的热量。冗余热量会导致电子设备的故障。一个重要的解决方案是制造导热复合材料以取代传统的包装材料。在此，我们报告用高达1.31Wm〜（-1）K〜（-1）的高横截面导热率，将银纳米颗粒沉积的氮化硼氮化硼纳米片/纳米纤维素复合物的制备报告。通过演奏桥接作用，银纳米粒子可以降低相邻氮化硼纳米片之间的界面热阻，从而在氮化硼纳米晶片/纳米纤维纤维素复合材料内部产生更多的导热途径。此外，银的掺入不会破坏原始氮化硼纳米片/纳米纤化纤维素复合材料的电绝缘。该策略开启了具有增强的导热性的聚合物基材料的新见解。

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