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首页> 外文期刊>Chemical engineering journal >Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles
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Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles

机译:用银纳米粒子原位烧结,在环氧基复合材料中施工3D氮化硼纳米液/银网络,银纳米粒子原位烧结

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摘要

Polymer-based thermal conductive composites (PTCs) with good thermal and mechanical properties are highly appreciated in the thermal management of modern electronic devices. However, the heat transfer property of particle-filled PTCs is severely limited by the thermal resistance at both filler-matrix and filler-filler interfaces. Intensive efforts have been taken to enhance the filler-matrix interface, however, the effect of filler-filler thermal contact resistance on the heat transfer properties of PTCs is still not very clear. In this work, continuous thermal conductive networks with good filler-filler interface contact are formed in epoxy composites via the in-situ sintering of silver nanoparticles on the surface of boron nitride nanosheets (BNNS). In this composites, homogeneously dispersed and well exfoliated BN nanosheets are bridged to each other via the sintered AgNPs located at the BNNS and a 3D boron nitride nanosheets network is formed with solid Ag junctions lying in between. After thermal sintering process, the thermal conductivity of EP/BNNS@AgNPs composite with the 3D boron nitride nanosheets network increase from 0.95 W/m.K to 1.13 W/m.K at the filler loading of 20 wt%, which indicates that merged AgNPs are used as thermal transport junctions to reduce the thermal contact resistance within 3D BNNS networks. The present strategy provides an effective route for developing high-performance PTCs.
机译:在现代电子设备的热管理中,高度赞赏具有良好热和机械性能的聚合物基热导体复合材料(PTC)。然而,颗粒填充的PTC的热转移性能受到填料 - 基质和填充填料界面的热阻的严重限制。已经采取了密集的努力来增强填料 - 基质界面,然而,填料 - 填料热接触电阻对PTCS的热传递性能的影响仍然不太清楚。在这项工作中,具有良好的填充填料界面接触的连续导热网络通过在氮化硼纳米片(BNNS)表面上的银纳米粒子的原位烧结形成环氧复合材料。在该复合材料中,通过位于BNNS处的烧结agnps彼此桥接,并且3D氮化物纳米晶片网络彼此桥接,并且形成在衬垫之间的固体Ag连接。在热烧结过程之后,在填料负载量为20wt%的填充剂负载下,与3D氮化硼纳米型网络的EP / BNNS @ AgNPS复合材料的导热率从0.95W / mK增加到1.13W / mK,这表明使用合并的AgNPS用作热传输交叉点降低3D BNNS网络内的热接触电阻。目前的策略为开发高性能PTC提供有效途径。

著录项

  • 来源
    《Chemical engineering journal》 |2019年第2019期|共11页
  • 作者单位

    Hubei Univ Fac Mat Sci &

    Engn Hubei Key Lab Polymer Mat Hubei Collaborat Innova Minist Educ Key Lab Green Preparat &

    Applicat Fun Wuhan 430062 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol Sch Chem &

    Chem Engn Minist Educ Key Lab Mat Chem Energy Convers &

    Storage Wuhan 430074 Hubei Peoples R China;

    IMDEA Mat Inst C Eric Kandel 2 Madrid 28906 Spain;

    Huazhong Univ Sci &

    Technol Sch Chem &

    Chem Engn Minist Educ Key Lab Mat Chem Energy Convers &

    Storage Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol Sch Chem &

    Chem Engn Minist Educ Key Lab Mat Chem Energy Convers &

    Storage Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol Sch Chem &

    Chem Engn Minist Educ Key Lab Mat Chem Energy Convers &

    Storage Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol Sch Chem &

    Chem Engn Minist Educ Key Lab Mat Chem Energy Convers &

    Storage Wuhan 430074 Hubei Peoples R China;

    Hubei Univ Fac Mat Sci &

    Engn Hubei Key Lab Polymer Mat Hubei Collaborat Innova Minist Educ Key Lab Green Preparat &

    Applicat Fun Wuhan 430062 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol Sch Chem &

    Chem Engn Minist Educ Key Lab Mat Chem Energy Convers &

    Storage Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol Sch Chem &

    Chem Engn Minist Educ Key Lab Mat Chem Energy Convers &

    Storage Wuhan 430074 Hubei Peoples R China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 化学工业;
  • 关键词

    Epoxy nanocomposites; Thermal conductivity; Interfacial thermal resistance; Boron nitride nanosheets; Mechanical properties;

    机译:环氧纳米复合材料;导热系数;界面热阻;氮化硼纳米晶片;机械性能;

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