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首页> 外文会议>IEEE Electronic Components and Technology Conference >Site-selective fabrication of patterned transparent copper mesh on flexible substrates at mild temperature for green, low cost electronics
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Site-selective fabrication of patterned transparent copper mesh on flexible substrates at mild temperature for green, low cost electronics

机译：在柔和的温度下，选择性地在柔性基板上选择性地制作图案化的透明铜网，用于绿色，低成本的电子产品

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A high-performance transparent conductor which is inexpensive, flexible and low-temperature deposited is essential for fabrication of a variety of printed electronic devices. Recently, copper nanomaterials have received increasing attention as a good candidate due to its low cost and plentiful supply. However, there are three crucial issues need to be addressed: (1) strong adhesion between printed copper nanomaterials and the flexible substrates, (2) anti-oxidation of copper nanomaterials in air and (3) the relative lower sintering temperature below the Tg of common polymer foils (e.g. PET). Here, a new approach based on the combination of mussel-inspired surface modification and patterning technology was developed to fabricate the transparent copper mesh. The approach involves (i) deposition of poly(dopamine) (PDA), an excellent stable adhesive on the flexible substrate in the aqueous dopamine solution at room temperature for several minutes, (ii) development of the PDA patterns via a simple and rapid photolithography or microcontact printing technique, and (iii) green electroless plating of copper only on the exposed PDA regions, the chemi-sorption sites of metal ions, without any catalyst at mild temperature. This approach enables an alternative to carbon nanotubes, graphene and silver nanowires based flexible transparent conductors and indium tin oxide based brittle transparent conductors. The micro structure, resistivity, transparency and peel strength of copper mesh were examined by scanning electron microscopy, four-point probe technique, UV-vis, 90° peel test. As a result, the smooth copper pattern exhibited uniform thickness, strong adhesion to substrate and low sheet resistance, which was still stable even stored in air for several months.
机译：廉价，柔性和低温沉积的高性能透明导体对于制造各种印刷电子设备至关重要。近来，由于铜纳米材料的低成本和充足的供应，铜纳米材料作为良好的候选者已受到越来越多的关注。但是，需要解决三个关键问题：（1）印刷的铜纳米材料与柔性基板之间的牢固粘合力;（2）空气中铜纳米材料的抗氧化性;（3）低于T <的相对较低的烧结温度inf> g 常见的聚合物箔（例如PET）。在这里，开发了一种基于贻贝启发的表面改性和图案化技术相结合的新方法来制造透明铜网。该方法涉及（i）在室温下在多巴胺水溶液中的柔性基材上在室温下沉积聚（多巴胺）（PDA）极好的稳定粘合剂几分钟;（ii）通过简单快速的光刻法显影PDA图案或微接触印刷技术，以及（iii）仅在裸露的PDA区域（金属离子的化学吸附位点）上进行化学镀铜，而在中等温度下无需任何催化剂。这种方法可以替代基于碳纳米管，石墨烯和银纳米线的柔性透明导体和基于铟锡氧化物的脆性透明导体。通过扫描电子显微镜，四点探针技术，UV-vis，90°剥离测试，检查了铜网的微观结构，电阻率，透明性和剥离强度。结果，光滑的铜图案表现出均匀的厚度，对基板的强粘附性和低的薄层电阻，即使在空气中存储数月也仍然稳定。

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