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首页> 外文会议>IEEE Electronic Components and Technology Conference >A Novel Dicing Technologies for WLCSP Using Stealth Dicing through Dicing Tape and Back Side Protection-Film
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A Novel Dicing Technologies for WLCSP Using Stealth Dicing through Dicing Tape and Back Side Protection-Film

机译：WLCSP通过切割胶带和背侧保护膜的WLCSP的一种新型切割技术

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Market demand of IC package for communication is increasing along with the popularization of mobile type of information and communication devices. Wafer Level Chip Scale Package (WLCSP) is popular method for above mentioned devices from production cost point of view and is widely used for this kind of mobile devices. There are two requirements for the WLCSP nowadays. One is a cost reduction, the other is a solution to package crack. The main idea of a cost reduction is a dicing street reduction. The dicing street reduction leads to the increasing the number of die per wafer (die gross) that means a reduction of production cost. We select a "Stealth dicing" process. SD process is expected to increase the number of die that can be obtained from a wafer compared to normal dicing because it is possible to make the necessary street width (cut width) narrower. Almost WLCSPs are typically mounted on board with only solder joint, without under fill and so solder joint reliability is a prime concern. Especially side walls of WLCSP are not covered with protection material like under fill, so mechanical damage on side walls caused by dicing process leads to package crack at Thermal Cycle Test (TCT). This side wall damage and cracks are serious problem recently. SD process might avoid this side wall crack also. In this paper, we propose a novel dicing technologies for WLCSP using stealth dicing through dicing tape and back side protection-film that can make the necessary street width (cut width) narrower that means street reduction and avoid the package crack of TCT and the drop test.
机译：随着移动类型的信息和通信设备的推广，IC包的市场需求正在增加。晶圆级芯片刻度封装（WLCSP）是从生产成本观点的上述设备的流行方法，广泛用于这种移动设备。现在有两个WLCSP要求。一个是降低成本，另一个是包装裂缝的解决方案。降低成本的主要思想是切割街道减少。切割街道减少导致增加每个晶片（模具总体）的模具数量，这意味着降低生产成本。我们选择“隐形切割”过程。预计SD过程将增加与正常切割相比可以从晶片获得的模具的数量，因为可以使必要的街道宽度（切割宽度）较窄。几乎WLCSP通常安装在船上，只有焊点，而无需填充，因此焊点可靠性是一个主要关注点。特别是WLCSP的侧壁未被填充的保护材料覆盖，因此由切割过程引起的侧壁上的机械损坏导致封装裂纹在热循环测试（TCT）。最近这种侧壁损坏和裂缝是严重的问题。 SD过程也可能避免这种侧壁裂缝。在本文中，我们提出了一种使用隐形切割的WLCSP通过切割胶带和背面保护膜来提出一种新的切割技术，可以使必要的街道宽度（切割宽度）较窄，这意味着街道减少，避免TCT的包装裂缝和下降测试。

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