An unique sample pretreatment method for circuit edit on WLCSP devices

机译：在WLCSP器件上进行电路编辑的独特样品预处理方法

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In the present work, the thick organic passivation layer of WLCSP products was uniformly removed before the focused ion beam (FIB) circuit edit (CE) process. By this approach, the cycle time of the whole CE process can be remarkably decreased and the successful rate can be effectively increased. In addition, the suggested flows for successful CE under solder bumps and RDLs have been proposed.

机译：在当前工作中，在聚焦离子束（FIB）电路编辑（CE）工艺之前，已均匀去除WLCSP产品的厚有机钝化层。通过这种方法，可以显着减少整个CE过程的周期时间，并可以有效地提高成功率。另外，已经提出了在焊料凸点和RDL下成功获得CE的建议流程。

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《International Symposium on the Physical and Failure Analysis of Integrated Circuits》|2014年|110-113|共4页
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Chen Sheng-Yu; Wang Chino; Wu Puma;
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Failure analysis; Integrated circuits;

机译：故障分析;集成电路;

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1. Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices [J] . Tao-Chi Liu, Chih Chen, Shih-Ting Liu, Journal of materials science . 2011,第10期

机译：晶圆级芯片规模封装（WLCSP）器件上聚焦离子束（FIB）进行电路编辑的创新方法
2. Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices [J] . Tao-Chi Liu, Chih Chen, Shih-Ting Liu, Journal of Materials Science: Materials in Electronics . 2011,第10期

机译：晶圆级芯片规模封装（WLCSP）器件上聚焦离子束（FIB）进行电路编辑的创新方法
3. Reliability of Lead-free Solder Joints in WLCSP Device with Finite Element Simulation and Taguchi Method [J] . Liang Zhang, Lei Sun, Ji-guang Han, International journal of nonlinear sciences and numerical simulation . 2014,第6期

机译：有限元模拟和田口方法在WLCSP装置中无铅焊点的可靠性
4. An unique sample pretreatment method for circuit edit on WLCSP devices [C] . Chen Sheng-Yu, Wang Chino, Wu Puma International Symposium on the Physical and Failure Analysis of Integrated Circuits . 2014

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An unique sample pretreatment method for circuit edit on WLCSP devices

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