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Simulation Based Defect Printability Analysis on Attenuated Phase Shifting Masks

机译:仿真基于缺陷可印刷性分析衰减相移掩模

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Simulated wafer images for Attenuated Phase Shift Mask (ATTPSM) features are performed by the Virtual Stepper? System. The ATTPSM test reticles were prepared with programmed defects (hard defects and phase defects) on line/space patterns, contact hole patterns, and rectangle patterns for 150-nm design rules. Each defect area was inspected using KLA-Tencor's UV-HR365 and SLF27 inspection systems. Virtual Stepper simulations are compared with Aerial Image Measurement System (AIMS~(TM)) simulation at best focus and at multiple defocus levels. In addition, simulation accuracy from different inspection images is compared.
机译:用于减毒相移掩模(ATTPSM)功能的模拟晶片图像由虚拟步进器执行?系统。在线/空间图案,接触孔图案和150nm设计规则的线/空间图案,接触孔图案和矩形图案上制备ATPSM测试掩模。使用KLA-Tencor的UV-HR365和SLF27检测系统检查每个缺陷区域。将虚拟步进模拟与空中图像测量系统(AIMS〜(TM))模拟进行比较,并在最佳焦点和多个散焦水平上进行模拟。此外,比较了不同检查图像的模拟精度。

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