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Pattern fidelity improvement by considering the underlying patterns at defocus

机译：通过考虑散焦的潜在模式来解决富力学改善

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The model-based OPC is considered in 0.13um and beyond generation. However, the accuracy of model-based OPC is based on the measurement of test patterns on bare silicon wafers using the optimized exposure condition. The through pitch patterns and systematic patterns should be contained in the test patterns design. Experiments showed that that the accuracy of model would be constrained if the underlying pattern effects would not be considered. The CD performance at the defocus and process window would also suffer since not considering the underlying pattern effects. This CD performance at defocus level and process window will be worse at damascene process. In this paper, we propose a hybrid OPC to cover these issues. In this work, we can use a simple method to investigate the underlying impact on the target layer on which we want to implement OPC to improve the pattern fidelity. We can observe the impact of underlying layer by studying the CD of critical patterns at de-focus level. This experiment provides us the CD data for considering the underlying impact without relying on theoretical foundation. With the hybrid OPC, we can find the exposure latitude has been improved.
机译：基于模型的OPC被认为是0.13um及之外的一代。然而，基于模型的OPC的准确性基于使用优化的曝光条件的裸硅晶片上的测试图案的测量。应包含在测试模式设计中的透气谱模式和系统模式。实验表明，如果不考虑潜在的模式效应，模型的准确性将受到限制。 Defocus和Process Window的CD性能也会受到影响，因为不考虑潜在的模式效果。 Defocus Level和Process Window的此CD性能将在镶嵌过程中更差。在本文中，我们提出了一个混合opc来涵盖这些问题。在这项工作中，我们可以使用简单的方法来调查我们希望实施OPC来改善模式保真度的目标层的潜在影响。我们可以通过在去焦水平下研究临界模式的CD来观察底层层的影响。该实验为我们提供了CD数据，以考虑潜在的影响而不依赖理论基础。通过混合opc，我们可以找到曝光纬度得到了改善。

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