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A study of feed-forward strategies for overlay control in lithography processes using CGS technology

机译：使用CGS技术进行光刻过程中的覆盖控制的前馈策略研究

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In advanced lithography, controlling the overlay budget is one of the most critical requirements. For device nodes at 10nm and below, there are many process-based sources of surface displacement that contribute to the lithography overlay budget that are independent of the lithography process, i.e. etch, anneal, CMP, etc. By developing an understanding of how process-induced surface displacement impacts overlay, displacement information can be fed-forward to the lithography tool for overlay correction during the lithography process. This paper describes the use of displacement measurement technology, the Coherent Gradient Sensing (CGS) interferometer, to characterize the effects of process-induced overlay error on the overlay budget through several processes in a typical semiconductor process flow. The CGS technique facilitates the generation of high-density displacement maps (>3 million points on 300mm wafer) such that the stresses induced die-by-die and process-by-process can be tracked in detail. Case studies are presented that summarize the use of the CGS data to reveal correlations between displacement variation and overlay variation, and demonstrate how feed forward can be applied for controlling overlay error.
机译：在高级光刻中，控制覆盖预算是最关键的要求之一。对于10nm及以下的器件节点，有许多基于工艺的表面位移源会增加光刻覆盖预算，而与光刻工艺无关，例如蚀刻，退火，CMP等。由于表面位移会影响覆盖，因此可以将位移信息前馈到光刻工具，以在光刻过程中进行覆盖校正。本文介绍了位移测量技术（相干梯度传感（CGS）干涉仪）的使用，以通过典型的半导体工艺流程中的多个工艺来表征工艺引起的叠层误差对叠层预算的影响。 CGS技术有助于生成高密度位移图（在300mm晶圆上> 300万个点），从而可以详细跟踪逐个芯片和逐个工艺引起的应力。提出的案例研究总结了CGS数据的使用，以揭示位移变化和覆盖变化之间的相关性，并演示了如何将前馈应用于控制覆盖误差。

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