首页> 外文会议>Annual SEMI Advanced Semiconductor Manufacturing Conference >Use of simulation studies to overcome key challenges in the fab automation of a 300 mm power semiconductor pilot line comprising thin-wafer processing
【24h】

Use of simulation studies to overcome key challenges in the fab automation of a 300 mm power semiconductor pilot line comprising thin-wafer processing

机译:利用仿真研究来克服300毫米功率半导体中试线(包括薄晶圆处理)的工厂自动化中的关键挑战

获取原文

摘要

Infineon Technologies Dresden establishes the worldwide first highly automated high volume production for power semiconductors based on 300 mm thin wafer technologies. For this special manufacturing platform, there are a lot of challenges for manufacturing and automation. During the research phases in preparation for the future 300 mm pilot lines different simulation studies for wafers, substrates and the existing transportation system are powerful methods to get out the best manufacturing and automation concepts for the future fabs. This article gives an overview of key challenges and shows ways how to overcome the obstacles using innovative manufacturing and automation applications optimized through smart simulation.
机译:Infineon Technologies Dresden建立了全球首个基于300毫米薄晶圆技术的功率半导体高度自动化大批量生产的系统。对于这个特殊的制造平台,制造和自动化面临很多挑战。在准备未来300毫米试验线的研究阶段中,对晶圆,基板和现有运输系统进行的不同模拟研究是为未来的晶圆厂提供最佳制造和自动化概念的有力方法。本文概述了主要挑战,并展示了如何使用通过智能仿真优化的创新制造和自动化应用程序来克服障碍的方法。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号