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Large Area Coating: Solutions and Opportunities from High Power Pulsing

机译:大面积涂层:大功率脉冲产生的解决方案和机会

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Magnetron sputtering is used to deposit large area multi-layer structures for photovoltaic (PV) panels, flat panel displays (FPD), architectural and automotive glass, and flexible webs. Pulsed power is used for reactive deposition of dielectrics. It enables reactive sputtering of dielectrics that are essentially impossible with straight DC, owing to periodic discharge of the voltage on dielectric films deposited on the target itself, preventing target arcs and helping to mitigate anode coverage. The concept was introduced in the 1970s. Pulsed reversal was developed industrially in the 1990s. Further innovation broadened the solution space to include control of material characteristics like morphology and crystallinity, and process measurement and control. Pulsed techniques for dual magnetron sputtering (DMS) enable reduced energy consumption by operation at the minimum frequency consistent with stable process operation. Now stable processes are possible at lower frequencies due to faster arc handling and reduced arc energy. Greater rate can be achieved by running incrementally higher on the transition curve, by controlling the working point of each magnetron in the DMS pair. Process measurement and control are enhanced by quasi-DC conditions accessed by quasi-current source pulsed power solutions. New developments, key solutions, and opportunities driven by pulsed power capabilities are presented.
机译:磁控溅射用于沉积大面积的多层结构,用于光伏(PV)面板,平板显示器(FPD),建筑和汽车玻璃以及柔性纤维网。脉冲功率用于电介质的反应性沉积。由于能够定期放电沉积在靶材本身上的介电膜上的电压,因此能够实现电介质的反应性溅射,而对于直流电来说,这基本上是不可能的,这可以防止靶材产生电弧并有助于减轻阳极覆盖。这个概念是在1970年代提出的。脉冲反转是在1990年代工业化开发的。进一步的创新拓宽了解决方案的空间,包括对材料特性(如形态和结晶度)的控制以及过程的测量和控制。双磁控溅射(DMS)的脉冲技术可通过以稳定的工艺操作实现的最低频率进行操作,从而降低能耗。由于更快的电弧处理和降低的电弧能量,现在可以在较低的频率下进行稳定的工艺。通过控制DMS对中每个磁控管的工作点,可以通过在过渡曲线上递增地运行来获得更高的速率。通过准电流源脉冲电源解决方案访问的准DC条件,可以增强过程测量和控制能力。介绍了脉冲电源功能带来的新发展,关键解决方案和机遇。

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