Future Interconnect Materials and System Integration Strategies for Data-Intensive Applications

机译：数据密集型应用的未来互连材料和系统集成策略

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The microelectronics industry today faces multiple inflections: increasing technology complexity, emerging data-intensive market drivers like the Internet of Things (IoT) and Artificial Intelligence (AI), and an increasing focus on system-level integration & optimization. These inflections challenge the industry to build innovative collaboration models that cut across traditional silos. SEMI has built a collaborative platform specifically to address this challenge by providing early and comprehensive assessment of future technologies (5-8 years out). The first project focused on interconnect materials and integration strategies, which are critical to most computing systems. Specific elements studied here include the increase in resistivity with narrowing wire-widths, supply-chain issues with proposed solutions, and the impact on latency for simple circuit systems. In addition, we also compared a two-dimensional (2D) system with an interposer-based system (2.5D) to quantify the impact of the latter on the energy-delay product for various applications.

机译：如今的微电子行业面临着多种变化：技术复杂性不断提高，诸如物联网（IoT）和人工智能（AI）等新兴的数据密集型市场驱动力以及对系统级集成和优化的日益关注。这些变化挑战了行业，以建立跨越传统孤岛的创新协作模型。 SEMI建立了一个协作平台，专门针对这一挑战，它会提供对未来技术的早期和全面评估（5-8年）。第一个项目侧重于互连材料和集成策略，这对于大多数计算系统而言都是至关重要的。这里研究的具体要素包括随着线宽变窄而导致的电阻率增加，提议的解决方案带来的供应链问题以及对简单电路系统的等待时间的影响。此外，我们还比较了二维（2D）系统和基于插入器的系统（2.5D），以量化后者对各种应用中的能量延迟产品的影响。

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《Electronic System-Integration Technology Conference》|2018年|1-5|共5页
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Pushkar Apte; Tom Salmon; Richard Rice; Mark Gerber; Rozalia Beica; Jeff Calvert; Dave Hemker; Yezdi Dordi; Manish Ranjan; Suresh Ramalingam; Jaspreet Gandhi; Alireza Kaviani; Subhasish Mitra; Philip Wong; Vincent Lee Stanford; Mohamed El-Sabry;
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Conductivity; Wires; Industries; Delays; Integrated circuit modeling; Integrated circuit interconnections; Metals;

机译：电导率;电线;工业;延迟;集成电路建模;集成电路互连;金属;

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Future Interconnect Materials and System Integration Strategies for Data-Intensive Applications

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