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首页> 外文会议>European Microwave Conference >Fully Inkjet-Printed Ramp Interconnects for Wireless Ka-Band MMIC Devices and Multi-Chip Module Packaging
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Fully Inkjet-Printed Ramp Interconnects for Wireless Ka-Band MMIC Devices and Multi-Chip Module Packaging

机译：用于无线Ka波段MMIC设备和多芯片模块封装的完全喷墨印刷的斜坡互连

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This work outlines for the first time the development and demonstration of fully inkjet-printed mm-wave 3D ramp interconnects for Ka-band active wireless devices and MCM packaging solutions. Details of the inkjet printing processes are outlined to realize printed RF and DC interconnects for active MMIC dies. Printed ramp interconnects are demonstrated first with an attenuator die to evaluate the multi-material fabrication process, yielding an interconnect insertion loss of approximately 0.45 dB/mm at 24.5 GHz. The process is then applied to a Ka-band LNA MMIC where ramp interconnects for the RF and DC are inkjet-printed, yielding a maximum aggregate gain of 24.2 dB and interconnect insertion loss of approximately 0.57 dB/mm. The fabrication processes and evaluative demonstrations presented in this work highlight the effectiveness of utilizing fully-additive inkjet printing technology for the realization of highly application-specific wireless MCM systems in a low-cost and efficient fashion up to the mm-wave frequency range.
机译：这项工作首次概述了用于Ka波段有源无线设备和MCM封装解决方案的全喷墨打印毫米波3D斜坡互连的开发和演示。概述了喷墨印刷工艺的详细信息，以实现有源MMIC裸片的印刷RF和DC互连。首先用衰减器裸片演示印刷斜面互连，以评估多材料制造工艺，在24.5 GHz时产生约0.45 dB / mm的互连插入损耗。然后，将该过程应用于Ka波段LNA MMIC，其中用于RF和DC的斜坡互连被喷墨打印，从而产生24.2 dB的最大总增益和大约0.57 dB / mm的互连插入损耗。这项工作中提出的制造工艺和评估演示突出了利用全加性喷墨打印技术以高达毫米波频率范围的低成本和高效方式实现高度专用的无线MCM系统的有效性。

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