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首页> 外文会议>Electronic Components and Technology Conference, 1994. Proceedings., 44th >Electrical characterization of the interconnected mesh power system (IMPS) MCM topology
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Electrical characterization of the interconnected mesh power system (IMPS) MCM topology

机译：互连网状电源系统（IMPS）MCM拓扑的电气特性

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A significant decrease in MCM substrate production cost can be achieved by reducing the number of substrate layers from the conventional four or five (power, ground, X signal, Y signal, pad) to two or three. Besides reducing direct processing steps, yield will also increase as defect producing operations are eliminated. This paper describes the Interconnected Mesh Power System (IMPS), a new interconnection topology which leverages the production technologies of fine line lithography and batch via generation to allow planar power and ground distribution, and dense signal interconnection, on only two metal layers. Several possible implementations of the topology in MCM-D and MCM-L are described. The design of a test vehicle which characterizes both the signal transmission and power distribution properties of the IMPS topology is discussed. The test vehicle has been built in an aluminum/polyimide on silicon process developed at HiDEC. Results of signal transmission measurements (impedance, delay, and crosstalk) for various signal/power/ground configurations are presented. Power distribution characteristics (DC drops and AC noise) are presented and compared with measurements on a test vehicle implemented with solid power and ground planes. From the measured characteristics of the test vehicle, the applicability (clock frequency, power, etc.) for the IMPS topology has been determined. Most MCM applications can benefit from the substrate cost reduction enabled by IMPS.
机译：通过将基板的层数从常规的四层或五层（电源，地线，X信号，Y信号，焊盘）减少到两层或三层，可以大大降低MCM基板的生产成本。除了减少直接处理步骤之外，由于消除了缺陷产生操作，因此产量也将提高。本文介绍了互连网状电源系统（IMPS），这是一种新的互连拓扑，该拓扑利用细线光刻和批量生产的生产技术，仅在两个金属层上允许平面电源和地面分布以及密集的信号互连。描述了MCM-D和MCM-L中拓扑的几种可能的实现方式。讨论了测试车辆的设计，该车辆既表征了IMPS拓扑结构的信号传输特性，又表征了功率分布特性。该测试车采用HiDEC开发的铝/硅上聚酰亚胺工艺制造。给出了各种信号/电源/接地配置的信号传输测量结果（阻抗，延迟和串扰）。展示了功率分布特性（直流降和交流噪声），并将其与在实心电源和地平面上实现的测试车辆的测量结果进行了比较。根据测试车辆的测量特性，确定了IMPS拓扑的适用性（时钟频率，功率等）。大多数MCM应用可受益于IMPS降低的基板成本。

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