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首页> 外文会议>Electronic Components and Technology Conference, 1994. Proceedings., 44th >Fracture properties of molding compound materials for IC plastic packaging
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Fracture properties of molding compound materials for IC plastic packaging

机译：IC塑料封装用模塑复合材料的断裂特性

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The technique of linear elastic fracture mechanics was employed to characterize the fracture toughness of different molding compound materials. The effect of fast thermal loading rate as in a wave soldering condition was studied by performing the fracture toughness tests at different mechanical loading speeds. The effects of storage conditions and accelerated testing environments were studied by varying the test temperatures from liquid nitrogen temperature to 150/spl deg/C. Models were built of 208 I/O PQFP devices with cracks in the molding compound at the corner of the die pad. These models were solved to evaluate the effect of CTE mismatches, initial flaw sizes and die pad delamination on molding compound stress intensity factors. Finite element results were then compared with crack growth measurements from PQFP packages which had been subjected to accelerated thermal cycling.
机译：采用线性弹性断裂力学技术来表征不同模塑料的断裂韧性。通过在不同的机械加载速度下进行断裂韧性测试，研究了在波峰焊接条件下快速热加载速率的影响。通过将测试温度从液氮温度更改为150 / spl deg / C，研究了存储条件和加速测试环境的影响。模型是由208个I / O PQFP器件构建的，在芯片焊盘的角部的模塑料中存在裂缝。解决了这些模型，以评估CTE不匹配，初始缺陷尺寸和管芯焊盘分层对模塑料应力强度因子的影响。然后将有限元结果与经过加速热循环的PQFP封装的裂纹扩展测量结果进行了比较。

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