Advanced PVD Ti/TiN liners for contact and via a

机译：先进的PVD Ti / TiN衬垫，用于接触和通过

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Abstract: The benefits of different advanced PVD methods for Ti/TiN films, collimated, longthrow and ionized PVD, are compared to conventional or standard magnetron sputtering with respect to future requirements. Special attention is given to integration aspects in combination with W-plugs and hot Al-fill techniques for contact applications. Besides basic film properties and step coverage data, electrical results for contacts are reported. The dependence of the contact resistance on the bottom Ti thickness is explained, and a new spiking model for Al-filled contacts is proposed. Finally specific manufacturing issues like throughput, target life time and defect densities will be addressed also.!19

机译：摘要：针对未来需求，将传统的或标准的磁控溅射与Ti / TiN薄膜的不同先进PVD方法（准直，长掷和离子化PVD）的优点进行了比较。对于与接触应用相结合的W形插头和热Al填充技术，集成方面给予了特别的关注。除了基本的膜特性和台阶覆盖率数据外，还报告了触点的电学结果。解释了接触电阻对底部Ti厚度的依赖性，并提出了一种用于Al填充触点的新型尖峰模型。最后，还将解决特定的制造问题，例如吞吐量，目标使用寿命和缺陷密度。！19

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《Multilevel Interconnect Technology》|1997年|p.2-12|共1页
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Hans-Joachim Barth; Siemens AG; Muenchen; Germany; J.Bierner; Siemens AG; Regensburg; Germany; H.Helneder; Siemens AG; Munich; Germany; W.Robl; Siemens AG; Regensburg; Germany; K.Schober; Siemens AG; Munich; Germany; Manfred Schneegans; Siemens AG; Muenchen; Germany.;
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中图分类无线电电子学、电信技术;
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2. Ti/TiN/Ti(N) PVD liners for W-plug applications [J] . S. Daniels, R.A.M. Wolters, J. van Zijl Microelectronic Engineering . 2000,第1a4期

机译：适用于W-plug应用的Ti / TiN / Ti（N）PVD衬里
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机译：与iPVD Ti和CVD Ru集成的先进iPVD Cu工艺的自底向上沉积
4. Ti + TiN, Ti + Ti(C_xN_(1-x)), Ti + TiC PVD coatings on the ASP 30 sintered high-speed steel [J] . W. Kwasny, L.A. Dobrzanski, S. Bugliosi Journal of Materials Processing Technology . 2004,第0期

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机译：用于先进技术的Ti和NiPt / Ti衬里硅化物触点
6. Tribological studies of MMC (aluminum/silicon carbide and aluminum/aluminum oxide) and MMC (nickel/silicon carbide) coated aluminum alloy engine cylinder liner materials in lubricated reciprocating contacts [D] . Ye, Zhaokuan 1995

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Advanced PVD Ti/TiN liners for contact and via a

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