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首页> 外文会议>Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th >Quantitative characterization of underfill/substrate interfacial toughness enhancement by silane additives
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Quantitative characterization of underfill/substrate interfacial toughness enhancement by silane additives

机译：硅烷添加剂增强底部填充胶/基材界面韧性的定量表征

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The apparent fracture toughness of the interfaces between epoxy-based underfill materials and various substrates is experimentally measured. A small amount of silane coupling agents is added to the base underfill to form various underfill derivatives. Double layer specimens with preexisting interfacial cracks are made for four-point bending tests. The substrates tested include aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. The measurements are qualitatively correlated to each silane additive. Although the purpose of adding silane additives was to enhance the adhesion, it is found that the enhancement of interfacial toughness depends on the type of substrate. The results of this study have important implications in flip-chip reliability where interfacial cracking is one of the major failure modes.
机译：环氧树脂基底部填充材料和各种基材之间的界面的表观断裂韧性是通过实验测量的。将少量硅烷偶联剂添加到基础底部填充剂中，以形成各种底部填充剂衍生物。制备具有预先存在的界面裂纹的双层试样，以进行四点弯曲测试。测试的基板包括铝，聚酰亚胺，BCB和带有阻焊膜的印刷线路板（FR-4）。该测量与每种硅烷添加剂在质量上相关。尽管添加硅烷添加剂的目的是增强粘合性，但是发现界面韧性的增强取决于基材的类型。这项研究的结果对于倒装芯片的可靠性具有重要的意义，其中界面裂纹是主要的失效模式之一。

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