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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Characterization of underfill/substrate interfacial toughness enhancement by silane additives
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Characterization of underfill/substrate interfacial toughness enhancement by silane additives

机译：硅烷添加剂增强底填料/基材界面韧性的表征

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This work experimentally measures the apparent fracture toughness of the interfaces between epoxy-based underfill materials and various substrates including aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. A small amount of silane coupling agent is added to the base underfill in order to form various underfill derivatives, and double layer specimens with preexisting interfacial cracks are prepared for four-point bending tests. The measurements are qualitatively correlated to each silane additive. The purpose of adding silane additives was to enhance the adhesion; the enhancement of interfacial toughness was found to strongly depend on the type of substrate. The results of this study have important implications in flip-chip reliability where interfacial cracking is one of the major failure modes.
机译：这项工作通过实验测量了环氧基底部填充材料与各种基材（包括铝，聚酰亚胺，BCB和带有阻焊层的印刷线路板（FR-4））之间的界面的明显断裂韧性。将少量的硅烷偶联剂添加到基础底部填充剂中，以形成各种底部填充剂衍生物，并准备具有预先存在的界面裂纹的双层试样进行四点弯曲测试。该测量与每种硅烷添加剂在质量上相关。加入硅烷添加剂的目的是增强附着力。发现界面韧性的增强很大程度上取决于基材的类型。这项研究的结果对于倒装芯片的可靠性具有重要的意义，其中界面裂纹是主要的失效模式之一。

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