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Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages

机译：倒装芯片封装中底部填充界面和整体断裂韧性的测量

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Flip-chip package reliability is greatly improved by encapsulating the solder interconnections between a polymeric encapsulant or underfill. However, thermo-mechanical stresses within such packages often lead to failures initiating in the vicinity of chip and underfill interface. In this study, we present experimental results geared towards measuring and understanding such failure mechanisms. We provide the bulk fracture toughness of the underfill material and interfacial fracture toughness between the underfill material and the silicon die. The bulk and interfacial fracture toughness measurements are performed as a function of temperature. We use the single edge notch bending test to calculate the bulk fracture toughness of the underfill and to measure the interfacial fracture toughness, we use a novel technique referred to as the wedge delamination method. The wedge delamination method provides substantial advantage in measuring the interfacial fracture toughness for brittle materials over traditional methods. Using the wedge delamination method we compare the fracture strength between the underfill and silicon at the front-face and side-wall interfaces. Additionally, the influence of dicing technique on fracture toughness is also investigated. (C) 2016 Elsevier Ltd. All rights reserved.
机译：通过封装聚合物密封剂或底部填充材料之间的焊料互连，可以大大提高倒装芯片封装的可靠性。但是，这种封装内的热机械应力通常会导致芯片和底部填充界面附近引发故障。在这项研究中，我们提出了旨在测量和理解这种失效机制的实验结果。我们提供了底部填充材料的整体断裂韧性以及底部填充材料和硅芯片之间的界面断裂韧性。本体和界面断裂韧性的测量是温度的函数。我们使用单边缘缺口弯曲测试来计算底部填充材料的整体断裂韧性，并测量界面断裂韧性，我们使用一种称为楔形分层方法的新技术。与传统方法相比，楔形分层方法在测量脆性材料的界面断裂韧性方面具有实质性优势。使用楔形分层方法，我们比较了正面和侧壁界面处底部填充胶和硅之间的断裂强度。另外，还研究了切割技术对断裂韧性的影响。 （C）2016 Elsevier Ltd.保留所有权利。

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