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首页> 外文期刊>IEEE transactions on device and materials reliability >Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling
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Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling

机译：倒装和底部填充对倒装芯片LED封装热性能的影响：测量和建模

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摘要

The goal of this paper is to experimentally and numerically study the thermal behaviors of flip-chip (FC) light-emitting diode (LED) packages with and without underfills and, furthermore, to compare it with conventional wire-bonding LED packages in order to understand its thermal dissipation mechanism. In experimental analyses, the junction temperature $T_{j}$ and surface temperatures are measured by a junction temperature tester, thermal couples, and an infrared thermal imager, whereas the numerical analysis is carried out by an ANSYS simulation. After the validation of the simulation model with experimental results, the effects of FC bump number and underfill thermal conductivity on both $T_{j}$ and thermal resistance $R_{rm th}$ of the packages are investigated by this validated model. Furthermore, a simple model of effective thermal conductivity for a composite material of bumps and underfills is proposed for thermal analysis of the FCLED packages. Thermal results for the packages are presented and discussed in terms of volume fraction and thermal conductivity for bumps and underfills in this paper.
机译：本文的目的是通过实验和数值研究带和不带底部填充的倒装芯片（FC）发光二极管（LED）封装的热性能，此外，将其与常规引线键合LED封装进行比较，以便了解其散热机制。在实验分析中，结温$ T_ {j} $和表面温度通过结温测试仪，热电偶和红外热像仪进行测量，而数值分析则通过ANSYS仿真进行。在用实验结果验证了仿真模型之后，通过该验证模型研究了FC凸点数量和底部填充热导率对封装的$ T_ {j} $和热阻$ R_ {rm th} $的影响。此外，提出了用于凸块和底部填充材料的复合材料的有效导热率的简单模型，用于FCLED封装的热分析。本文以凸点和底部填充的体积分数和导热系数的形式介绍和讨论了封装的热结果。

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