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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
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Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging

机译：倒装芯片封装中底部填充物微波固化过程的化学热建模和有限元分析

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The reaction kinetics of microwave cure process of underfill materials in flip-chip packaging was investigated with nonisothermal kinetic method and compared with that of the thermal cure. Three-dimensional (3-D) nonlinear cure kinetic and transient heat transfer coupled model was solved by finite-element method (FEM) to simulate the microwave cure process. The accuracy of the program was verified using a simple heat conduction case by commercial FEM software. Temperature and conversion inside underfill during microwave cure process were evaluated by solving the nonlinear anisotropic heat conduction equation including internal heat generation produced by exothermic chemical reactions. Numerical results show that the iteration calculations are very sensitive to small changes in time step sizes. It was also found that variable frequency microwave can process underfill materials with uniform conversion under different curing temperatures.
机译：采用非等温动力学方法研究了倒装芯片封装中底部填充材料微波固化过程的反应动力学，并与热固化进行了比较。通过有限元方法（FEM）求解了三维（3-D）非线性固化动力学和瞬态传热耦合模型，以模拟微波固化过程。该程序的准确性已通过商业FEM软件使用简单的导热箱进行了验证。通过求解非线性各向异性热传导方程，包括放热化学反应产生的内部热量，评估了微波固化过程中底部填充材料的温度和转化率。数值结果表明，迭代计算对时间步长的微小变化非常敏感。还发现变频微波可以在不同的固化温度下以均匀的转化率处理底部填充材料。

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