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首页> 外文会议>Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International >Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package
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Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package

机译：基于有限元的焊点疲劳寿命预测，用于相同的芯片尺寸堆叠芯片比例球栅阵列封装

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Viscoplastic finite-element simulation methodologies were utilized to predict solder joint reliability for a same die size, stacked, chip scale, ball grid array package under accelerated temperature cycling conditions (-40C to +125C, 15 min ramps/15 min dwells). The effects of multiple die attach material configurations were investigated along with the thickness of the mold cap and spacer die. The solder structures accommodate the bulk of the plastic strain that is generated during accelerated temperature cycling due to the thermal expansion mismatch between the various materials that encompass the stacked die package. Since plastic strain is a dominant parameter that influences low-cycle fatigue, it was used as a basis for evaluation of solder joint structural integrity. The paper discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool and the corresponding results for the solder joint fatigue life.
机译：用于在加速温度循环条件（-40℃至+ 125℃的加速温度循环条件下的相同模尺寸，堆叠，芯片级，球网阵列封装的焊接有限元模拟方法。研究了多个模具附着材料构造的效果以及模具帽和间隔件的厚度。焊料结构容纳由于包含堆叠管芯封装的各种材料之间的热膨胀性匹配而在加速温度循环期间产生的塑料应变的体积。由于塑料菌株是影响低周期疲劳的主要参数，因此它被用作评估焊接联合结构完整性的基础。本文讨论了ANSYS有限元模拟软件工具中实施的分析方法以及焊接关节疲劳寿命的相应结果。

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