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Computationally efficient fatigue life prediction of area array solder joints: Comparison of empirical and damage based models.

机译：计算有效的区域阵列焊点疲劳寿命预测：基于经验的模型和基于损伤的模型的比较。

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摘要

Soldering is extensively used to assemble electronic components to printed circuit boards or chips to substrates in Microsystems. Solder joints serve as mechanical, thermal, and electrical interconnections, therefore, solder joint integrity is a key reliability concern. Predicting the reliability of solder joints is a complex problem due to its operation at high homologous temperatures coupled with the complex package design, stress, solder microstructure, and fatigue mechanisms in solder joints.; In the research presented here, different techniques in fatigue life prediction of solder joints as well as experimental procedures and microstructural analysis, are developed. The environmental conditions include an accelerated temperature cycling test and a more recent power cycling test, recently developed and believed as being more representative of the filed use conditions.; An examination of the local deformation mechanisms in the solder joints coupled with finite element simulations to elucidate local fatigue/creep driving forces can provide a more comprehensive understanding of the cyclic degradation processes. A thorough examination of fracture surfaces of solder joints extensively reported in this thesis reveals failure mechanisms induced by environmental conditions. The understanding of the relationship between the microstructural deformation mechanisms and the applied thermal stresses engenders failure models and standards that are in agreement with physical damage processes.; At the end, to alleviate the computational expense that has been a main drawback of non-empirical physics-based approaches, a hybrid fracture-damage approach is proposed. The selected cohesive zone model of Smith-Ferrante form was found to evolve in a manner similar to the continuum damage mechanics theory. This damage definition is therefore used to make decisions on crack progression. The fatigue life estimation and the predicted crack trajectories are in excellent agreement with experimental data and show promise in analyzing fatigue crack growth problems. More importantly, the calculated rate of damage change from the model shows excellent correlation with the microstructural change on the fracture surface of solder joint.
机译：焊接被广泛用于在Microsystems中将电子组件组装到印刷电路板或将芯片组装到基板。焊点用作机械，热和电的互连，因此，焊点完整性是关键的可靠性问题。预测焊点的可靠性是一个复杂的问题，这是由于其在较高的同源温度下运行，以及复杂的封装设计，应力，焊点微观结构和焊点的疲劳机理。在这里提出的研究中，开发了多种预测焊点疲劳寿命的技术，以及实验程序和微观结构分析。环境条件包括加速温度循环测试和最近开发的功率循环测试，最近开发并认为它们更代表了已提出的使用条件。对焊点中局部变形机制的研究与有限元模拟相结合，以阐明局部疲劳/蠕变驱动力，可以对循环退化过程提供更全面的了解。本文广泛报道的对焊点断裂表面的彻底检查揭示了环境条件引起的失效机理。对微观结构变形机制与所施加的热应力之间关系的理解导致了与物理损伤过程相一致的失效模型和标准。最后，为了减轻作为基于经验的非经验方法的主要缺点的计算费用，提出了一种混合断裂损伤方法。发现选择的Smith-Ferrante形式的内聚区模型以类似于连续损伤力学理论的方式演化。因此，该损伤定义用于确定裂纹的发展。疲劳寿命的估算和预测的裂纹轨迹与实验数据非常吻合，在分析疲劳裂纹扩展问题方面显示出希望。更重要的是，根据模型计算出的损伤变化率与焊点断裂表面的微观结构变化具有极好的相关性。

著录项

  • 作者

    Towashiraporn, Pongpinit.;

  • 作者单位

    University of Colorado at Boulder.;

  • 授予单位 University of Colorado at Boulder.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2003
  • 页码 118 p.
  • 总页数 118
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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