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Verification of the thin film metal layer thickness by energy dispersive X-ray

机译：通过能量色散X射线验证薄膜金属层的厚度

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摘要

Leadframe fabrication process normally involves additional thin film metal layer plating on the bulk copper substrate surface for wire bond purpose. The recent commonly adopted plating materials are silver, tin, and copper flake. To assess the thickness quality, the conventional X-section methods involving grinding and polishing process are utilized. However, the process may lead to inaccurate results, which stems from the occurrence of sample preparation artifact, such as smearing effect attributable to the grinding or polishing process. Thus, alternative advanced methods are developed for assessing the thin film metal layer thickness, such as Focus Ion Beam (FIB), SIMS profiling or XPS, readily available in worldwide market. However, these alternative measurement services are very costly and time consuming per sample measure. To cater the cost and long sample preparation time due to the abovementioned advanced methods, an Energy Dispersive X-ray (EDX) can be applied. In this study, the newly invented methodology breakthrough had been validated by applying EDX for the first time on known bulk elemental analysis purpose. EDX feature is not only useful for elemental analysis but also applicable for thin film-metal layer thickness measurement and bulk material densification determination. A promising result was observed from the detailed experiment work through applying EDX in this evaluation.
机译：引线框架的制造过程通常涉及在大块铜基板表面上进行额外的薄膜金属层电镀，以进行引线键合。最近普遍采用的电镀材料是银，锡和铜片。为了评估厚度质量，使用了涉及磨削和抛光工艺的常规X截面方法。但是，该过程可能会导致结果不准确，这是由于样品制备伪影的出现，例如由于研磨或抛光过程而产生的拖尾效应。因此，开发了用于评估薄膜金属层厚度的替代先进方法，例如聚焦离子束（FIB），SIMS轮廓分析或XPS，这些方法已在全球市场上广泛使用。但是，这些替代测量服务的每个样本测量非常昂贵且耗时。由于上述先进方法，为了满足成本和较长的样品制备时间，可以使用能量色散X射线（EDX）。在这项研究中，新发明的方法学突破已经通过将EDX首次用于已知的体质分析目的而得到了验证。 EDX功能不仅可用于元素分析，还可用于薄膜金属层的厚度测量和块状材料的致密化确定。通过在评估中应用EDX，从详细的实验工作中观察到了有希望的结果。

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