Silver bonding wire for BSOB(Bond-Stitch-on-Ball)/BBOS(Bonding-Ball-on-Stitch)

机译：BSOB（球上缝合线）/ BBOS（球上缝合线）用银焊线

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With gradually adopted silver alloy wire bonding in IC and LED Packaging, BSOB becomes a common practice for die stacking in IC packaging and Multi-die Serial Bonding in LED, BBOS is adopted only in LED field. This paper identify a kind of texture of silver alloy bonding wire via Electron Backscatter Diffraction (EBSD) analysis for more consistent BSOB/BBOS bonding with lower MTBA (Mean Time Between Assistant). the key factor is believed to be the anisotropy of the silver bonding wire. Fine tune in Silver alloy doping, adjustment of wire drawing and annealing parameters should be made to achieve this silver alloy bonding wire of high anisotropy nature.

机译：随着IC和LED封装中逐渐采用银合金引线键合，BSOB成为IC封装中的芯片堆叠和LED中的多管芯串行键合的常见惯例，BBOS仅在LED领域中采用。本文通过电子背散射衍射（EBSD）分析确定了一种银合金键合线的织构，以实现更一致的BSOB / BBOS键合和更低的MTBA（平均间隔时间）。关键因素被认为是银键合线的各向异性。应当对银合金掺杂进行微调，调整拉丝和退火参数，以实现具有高各向异性的银合金焊丝。

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《China Semiconductor Technology International Conference》|2016年|1-3|共3页
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Zhi Ren;
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1. Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization [J] . Ismail Roslina, Harun Fuaida, Zulkifli Muhammad Nubli, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2015,第10期

机译：银和镍钯-金-银金属镀层上的第二铜线键合的可焊性
2. Thermosonic Bonding of Gold Wire onto Silver Bonding Layer on the Bond Pads of Chips with Copper Interconnects [J] . CHENG-LI CHUANG, JONG-NING AOH Journal of Electronic Materials . 2006,第9期

机译：金线与铜互连芯片的键合焊盘上的银键合层上的热超声键合
3. Novel Decapsulation Method for Silver-Based Wire-Bond Semiconductor Packages With High Reliability Using Mixed Salt–Acid Chemistry [J] . Young-Ja Kim, Jinho Hah, Kyoung-Sik Moon, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2019,第8期

机译：混合盐酸化学法对高可靠性银基线键合半导体封装的新型解封方法
4. Silver bonding wire for BSOB(Bond-Stitch-on-Ball)/BBOS(Bonding-Ball-on-Stitch) [C] . Zhi Ren China Semiconductor Technology International Conference . 2016

机译：用于Bsob的银色键合线（粘结针串联）/ BBO（粘接球上缝合）
5. First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =電子封裝中的第一級互連：合金銀互聯金屬生長動力學和他們的機械可靠性對線束的影響 [D] . Tobias, Russell Howard. 2019

机译：First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =电子封装中的第一级互连：合金银互联金属生长动力学和他们的机械可靠性对线束的影响
6. A Case of Aneurysm of the Abdominal Aorta treated by the Introduction of Silver Wire; with a Description of Instruments invented and constructed by Mr. G. H. Colt to facilitate the introduction of Wire into Aneurysms [O] . DArcy Power, G. H. Colt 1903

机译：银丝导入治疗腹主动脉瘤1例；并附有由G. H. Colt先生发明和制造的仪器的说明以方便将导线引入动脉瘤
7. A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization [O] . Gomes Jimy 2015

机译：键合应力和工艺温度对铝金属化镀钯银丝键合影响的研究

Silver bonding wire for BSOB(Bond-Stitch-on-Ball)/BBOS(Bonding-Ball-on-Stitch)

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