The fingerprint sensor is promising as a personal identification method for the devices. For downsizing and the cost reduction of the fingerprint sensor, capacitance method is main stream for the portable devices such as Smartphone's. Conventionally, expensive sapphire glass has been used as insulating layer of fingerprint sensor, but sapphire glass is required to be replaced by low-cost substitute. The new molding compound technologies for fingerprint sensor are presented this time by using molding materials for the semiconductor encapsulation. It is thought that the high dielectric encapsulation resin using the alumina filler can contribute to the price reduction of the fingerprint sensor.
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