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2D heat dissipation materials for microelectronics cooling applications

机译：用于微电子冷却应用的2D散热材料

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摘要

The need for faster and smaller, as well as more reliable and efficient consumer electronic products has resulted in microelectronic components that produce progressively more heat. The resultant reliability issues from the increased heat flux are serious and hinder technological development. One solution for microelectronics cooling applications is 2D materials applied as heat spreaders and these include monolayer graphene, graphene based films, and monolayer hexagonal boron nitride and BN based films. In addition, thermal performances of the graphene heat spreader were also studied under different packaging structures, including wire bonding, cooling fins and flip chips. Finally, 2D hexagonal Boron nitride (h-BN) heat spreaders, fabricated by different methods, were characterized by different thermal characterization methods, such as resistance temperature detector (RTD) and Infrared (IR) methods. In conclusion, these new novel 2D materials developed show great potential for microelectronics cooling applications.
机译：对更快，更小以及更可靠，更高效的消费电子产品的需求已导致产生越来越多热量的微电子元件。由增加的热通量导致的可靠性问题是严重的，并且阻碍了技术发展。用于微电子冷却应用的一种解决方案是用作散热器的2D材料，这些材料包括单层石墨烯，石墨烯基薄膜以及单层六方氮化硼和BN基薄膜。此外，还研究了石墨烯散热器在不同封装结构下的热性能，包括引线键合，散热片和倒装芯片。最后，通过不同的热表征方法，如电阻温度检测器（RTD）和红外（IR）方法，对通过不同方法制造的二维六方氮化硼（h-BN）散热器进行了表征。总之，这些新的新颖的2D材料在微电子冷却应用中显示出巨大的潜力。

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