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首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >Reliability, lifetime prediction and accelerated testing ofprospective alternatives to lead based solders
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Reliability, lifetime prediction and accelerated testing ofprospective alternatives to lead based solders

机译：可靠性，寿命预测和加速测试铅基焊料的潜在替代品

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摘要

In this paper, the mechanical properties, especially those relatedto fatigue, of two lead-free solder systems: 96.5 Sn-3.5 Ag and 91 Sn-9Zn have been compared with those of 63 Sn-37 Pb solder to assess thereliability of lead-free solders as replacements for lead-tin solders insecond level surface mount technology (SMT) interconnects. The strategyadopted to reduce the time required for generating a mechanical propertydatabase is discussed along with models to predict fatigue life fromshort time tests and early test data. The performance ofsingle-connection feed-forward back-propagation neural nets in fatiguelifetime prediction is tested and compared with that of a semi-empiricalmodel
机译：在本文中，机械性能，尤其是那些相关的 两种无铅焊接系统的抗疲劳性能：96.5 Sn-3.5 Ag和91 Sn-9 Zn已与63 Sn-37 Pb焊料中的Zn进行比较，以评估Zn含量。 无铅焊料替代铅锡焊料的可靠性 二级表面贴装技术（SMT）互连。策略 用于减少产生机械性能所需的时间 讨论了数据库以及预测疲劳寿命的模型 短期测试和早期测试数据。的表现 疲劳中的单连接前馈反向传播神经网络 测试了寿命预测并将其与半经验预测进行了比较 模型

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